Electronics Forum | Mon Mar 29 11:48:43 EDT 2010 | davef
SAC BGA In A Sn/Pb Reflow Process Conclusion: Area array components (ball grid arrays, chip scale packages, flip chip packages) with Pbfree solder sphere alloys should not be reflowed using a tin/lead reflow profile due to the resulting non-uniform s
Electronics Forum | Mon May 13 12:50:35 EDT 2019 | robl
Hi Spoiltforchoice, it depends on what you pay for the printers new, but last time I looked there wasn't much difference in price between the DEKs and the Speedprint if you were buying multiple units. Remember there is huge markups on SMT kit. From
Electronics Forum | Mon Oct 02 11:16:44 EDT 2000 | aflewelling
A new book on "hermeticity" by Hal Greenhouse has been offered by William Andrew/Noyes Publishing to us for review. This subject deals with sealing integrity in electronic packaging. Is this a book you would be interested in reading and reviewing f
Electronics Forum | Mon Sep 11 00:31:13 EDT 2000 | rcsantos
Is there somebody who knows if there is a machine already available in market that can transfer die from wafer to waffle tray. This machine should a stand alone type or can be integrated to some P&P machine. What I'm trying to say is just like the on
Electronics Forum | Wed Aug 02 03:25:17 EDT 2000 | wpeng
Thank you for your email. If you have any updated information on lead-free issues, please inform me. My Address is Mrs. Weiqun Peng Electronics/Hardware Integration Nokia Research Center Itamerenkatu 11 - 13 FIN-00180 Helsinki Finland Mobile: +358
Electronics Forum | Thu Jun 08 09:37:56 EDT 2000 | obrienk
In a previous message, I asked for a company that could sell, setup, service a complete SMT line. Recently, we've been working with Universal Instruments getting quotes on a possible SMT line. So far, I've been impressed at the overall capabilities
Electronics Forum | Thu Jun 08 21:56:41 EDT 2000 | Thomas Ravener
There are many available: Simplimatic Process Control Technology (PCT) JOT PMJ Bosch Dynapace Nutek Applied Conveyor Engineering (ACE) A wholly owned division of Universal Instruments and made for UIC integration of their products. This is just but
Electronics Forum | Mon May 28 17:43:33 EDT 2001 | davef
Does this device have a integral heat sink / metal slug on top, like a TI TM320C6XXX er a Altera EP20K4XX? Compare the size of the pads on the interposer and the board. Compare the type solder mask [NSMD vs SMD] on the interposer and the board. Wh
Electronics Forum | Thu Jan 27 21:28:36 EST 2000 | G Henning
strong interface to CAD for programming a must. Integrate with MRP systems, online (web based) component parameter data? No CAD data? Why not scan the blank with the P&P and recognize footprints/ designators. Diagnostic messages must be concise and a
Electronics Forum | Tue Jan 25 17:47:01 EST 2000 | Dennis VanBuren
We are integrating an "Additive Process" on one of our boards - incorporating numerous mod wires, cuts, and new component placements. Some of the new runs pass next to fine pitch devices and will require stencil modifications to accommodate the Addit
