Electronics Forum | Thu Dec 12 13:53:01 EST 2002 | gregoryyork
Considering only Ionic residues is very dangerous, most heat transfer fluids that are extremely hygroscopic are also non ionic especially those used in HASL / Roller Tinning fluids. Also consider if the resist is cured or in fact porous which absorbs
Electronics Forum | Thu Mar 13 15:22:47 EST 2003 | ruggi
Ditto on the profile/reflow oven...a couple years ago, we had a huge increase in the number of tombstones found post-reflow. Profiling the oven showed a decent curve with some innocuous minor deviations, and further investigation of the oven found 2
Electronics Forum | Mon Apr 12 11:32:47 EDT 2004 | Luis Lazcano
Can you share some information on the hazardous materials and cleaning details for your manufacturing processes, please ? These are the questions I need to ask you: 1. Do you use brominated fire retardant in PWB material? If not, what other type
Electronics Forum | Wed Mar 15 09:53:58 EDT 2017 | rob
Hi Etimov, Understood that to us assembling parts that IPC is king, however it isn't neccesarily the bible for design engineers. We've had customers demand almost zero voiding, or had to use conductive epoxy to avoid it. For some of us solder joi
Electronics Forum | Wed Mar 15 10:21:08 EDT 2017 | pzappella
Hello Rob, I totally agree with you. Is this a real problem that is being shoved under the rug or just whatever voiding we get from a belt furnace is good enough. I think vacuum reflow can do much better but is a batch approach and not contin
Electronics Forum | Fri Mar 29 11:02:04 EDT 2019 | robl
Not sure it's always a great route as the smaller ovens are going to struggle to get a perfect profile for a consistent result, especially on bigger boards with higher layer counts and mixed technology. You may want to take a quick look at a batch va
Electronics Forum | Wed Oct 30 17:11:59 EDT 2019 | etmpalletguy
Yo Ho! I'm a little late to the party, sorry! Flex can be a simple PCB to process through Screen, Pick & Place & Reflow, if the card is designed properly. 4 symmetrical tooling holes .125" diameter and 5mm in on each corner of the card. Wedge Effect:
Electronics Forum | Tue Apr 10 04:16:20 EDT 2012 | grahamcooper22
you are seeing a typical issue that is caused when such small volumes of paste are printed....there are several reasons for it..the tiny amount of flux in the small deposit becomes exhausted much quicker then it does in a larger deposit ( the flux ma
Electronics Forum | Thu Jun 22 11:09:11 EDT 2000 | C.K.
TYPE of Preheater makes a HUGE difference, as well. Infrared (IR) and convection, 2 of the most common types of preheaters, have very different heat transfer characteristics..... Convection heats your board more uniformly, so you'll see very small
Electronics Forum | Wed Dec 20 22:24:03 EST 2000 | Greenman
Dave: In terms of heat transfer, air is 78% nitrogen, and the remainder is mostly (20.9%) oxygen (roughly the same molecular weight as nitrogen), with a bit of argon (0.9%), CO2, hydrogen, monosodium glutamate etc. So you would expect virtually no d
