Electronics Forum | Tue Apr 20 03:08:47 EDT 1999 | Scott Davies
| I had someone suggest that they weren't really necessary as long as your process is good. Is this just a way to help you keep an eye on your process? | | I was thinking, as we set up our line, our money would be more well spent with controlling t
Electronics Forum | Thu Aug 30 22:36:36 EDT 2001 | davef
While I don't understand why, this topic comes-up fairly often on SMTnet. [That the topic recurs indicates there truely is a problem and I'm just too doopy to understand it.] Several things: 1 Check the fine SMTnet Archives. 2 Some glue suppliers kn
Electronics Forum | Fri May 20 03:14:03 EDT 2016 | designhaus
Hello, We are about receive an 85.000 USD award grant towards purchasing manufacturing or testing equipment for our company. We are trying to figure out how to best use this grant. Here are short facts about us: We are a design house, so all our ma
Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3
To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads
Electronics Forum | Thu Jul 13 05:23:30 EDT 2000 | Donnie
There a few questions that I have for you. 1. What type of flux are you using? 2. What temps are your preheaters set at? 3. Can you possibly place them on after the wave? The reason I'm asking is that there may be some adjustments to the wave to bur
Electronics Forum | Mon May 10 12:15:46 EDT 1999 | Boca
We have been having an ongoing problems with radial electrolytic capacitors (thru hole)for some time. 1. When we wash them in our inline cleaners the sleeving shrinks up from the PCB leaving the 'can' exposed. Some designs have traces on the surf
Electronics Forum | Fri Oct 25 12:23:49 EDT 2002 | yngwie
Hi Experts, I'm facing short problem with BGA at SRT rework in one particular BGA. It is BGA, with a metal piece at the center like a coin. The BGA is located in between two high profile press fit connectors and the short always observed at the si
Electronics Forum | Mon Dec 19 08:56:18 EST 2005 | davef
Q1a. If the thickness of the silver is too much (how is too much??), A1a. We have heard stories of using Ag2 to limit silver [or gold] dissolution, but have never seen formal studies to demonstrate that idea. First, exclude the use of silver plate
Electronics Forum | Tue Jan 03 17:14:37 EST 2006 | mariss
To recap: 1) The machines use laser centering, not mech jaw centering. 2) The X7Rs are scattered on the board, center and edges. Improper de-panelization would favor damaging the parts near the edges of the board; this is not the case. 3) Both ROH
Electronics Forum | Fri Aug 17 10:50:15 EDT 2007 | Frank
I agree that the documentation should be used and not necessarily the silk screen. The silk screens can be a first line of defense, but nothing beats the proper documentation. Years ago I visited a contract manufacturer that a friend was working at
