Electronics Forum | Tue Dec 24 09:34:55 EST 2013 | emeto
Hi, it is a not given clear here. I will tell you some basics about the profiling: 1. Profile stages A. Preheat - the board preheats from room temp to 130-150C depending on the paste B. Soak - 150-170(or other range depending on the paste). here th
Electronics Forum | Wed Jan 04 10:34:04 EST 2006 | DannyJ
I don't believe you are missing anything, Amol. Mainly, you just need to make sure that your oven handles the higher temperatures needed for reflow. Also, there has been a lot of discussion on how many zones are needed to properly reflow lead-free
Electronics Forum | Wed May 28 05:49:19 EDT 2008 | aj
Hi all, I would like to know what sort of peak temps people are seeing during reflow - I understand that there are many variables that contribute to this but there should be an average through out all the profiles. We are still seeing issues with d
Electronics Forum | Mon Apr 09 19:50:33 EDT 2012 | action_101
Hello, We're building some boards with 01005's and the only issue we are running into is the solder is not reflowing. It's the damnest thing, we are having no issues with the printing process or placing the components, the two areas we thought we wo
Electronics Forum | Mon Apr 09 20:55:46 EDT 2012 | action_101
I forgot to add that we are using a 3 mil stencil. It seems like to me that may be there isn't enough flux left when we reach liquidous?? About half of the solder spheres do melt and wet on each pad, but the top half of each solder joint is just the
Electronics Forum | Wed Jul 10 21:56:36 EDT 2019 | SMTA-Ray
It's all about temperature versus time. The longer the over IE more zones the faster you can run. That doesn't seem to be the case for you so a 5 zone running a little slower will work. What many forget is that oven manufacturers can recommend what w
Electronics Forum | Wed Apr 04 03:07:16 EDT 2007 | pavel_murtishev
Good morning, Problem definition Poor soldering of thermistors with Ag/Pd termination Background Process: lead free reflow soldering Paste type: Multicore LF300, SAC305 Component type: 0805 chip thermistor, Ag/Pd termination PWB finish: immersion A
Electronics Forum | Mon Jan 19 20:01:11 EST 1998 | Steve Gregory
| We use no clean paste and sometimes experience | flux splattering which gives spot on gold fingers. | Need help in analize the cause. thx. Dominic, That is STILL a problem huh? It's a tough one to solve sometimes...especially when you have as
Electronics Forum | Tue Aug 22 14:59:55 EDT 2000 | Mike Naddra
What does the reflow profile look like , the question I had was surrounding the higher reflow temperature and the max temperature that lowest thermal mass components will see. Some other questions that I had were surrounding the components , what of
Electronics Forum | Wed Apr 26 13:28:26 EDT 2006 | TMC
No problem . . . I have been throught this road before. Here is another heads up, if you ask for "thermal profile data" you can get the following: 1. a graph showing several thermocouples reading air rather than board temperature. 2. graph where e
