Electronics Forum | Tue Feb 03 14:19:29 EST 2009 | grics
I would agree if you have a board to setup the process. But sometimes this doesn't work... If for some reason if the customers AVL has a Lead Free BGA and I am running Leaded paste (yes this really happens!), you will need to run hotter to get your
Electronics Forum | Fri Aug 27 15:00:42 EDT 2004 | davef
Dr Lee's book mentioned above is very good. Also consider: IPC-7530 - Guidelines for Temperature Profiling for Mass Soldering (Reflow and Wave)
Electronics Forum | Wed Jul 16 11:54:25 EDT 2003 | MA/NY DDave
Hi, I agree with everyone else talk to the Mfg and ask for their recommended profiles. They should know the heating and the cooling profiles. If you really want to do this yourself you are going to have to run several experiments to determine just
Electronics Forum | Tue Apr 09 08:44:43 EDT 2002 | davef
Read IPC-7530 "Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)". There is no advantage in dropping off much faster than 4�C/sec. In fact, you risk fracturing your newly formed solder connections due to board warping
Electronics Forum | Tue Apr 09 00:09:25 EDT 2002 | craigj
Question. When profiling and looking at the profiles cooling rate. Over what temperature range should the slope be monitored and what sort of cooling rates should be looked for. Paste supplier says no more than 6degC per sec, some components maybe lo
Electronics Forum | Tue Apr 09 08:49:43 EDT 2002 | davef
Hey Bud. Allow me to 'turn' your point about 'grain structure' just a bit. Fast cooling rates / coarse grain structures was a bit of red herring in the early 80's. Faster cooling DOES produce finer grained solder connections. Accelerated testing of
Electronics Forum | Fri Jun 06 04:52:21 EDT 2003 | kevyeoh
Hi all, I am just wondering is there any other Lead Free Standard Profile for IR reflow besides the standard provided by Jedec ? What if the profile that i use is different from the one provided by jedec ? Lets say the peak temperature for Jedec is
Electronics Forum | Mon Jun 18 13:29:34 EDT 2001 | nifhail
What is the recommanded profile for board which consist of 0402 & 0201 comps. to reduce the effect of tomb-stone. Slow ramp rate ? how slow is considered as slow. Soak time 60 or 120 C,at which end should I stick to? what is the best time before reac
Electronics Forum | Tue Apr 09 07:41:08 EDT 2002 | johnw
Craig, it depend's n what you want to look at. In term's of te gran structure of the solder jont that's formed when the joint is cooling so you'd want to monitor the temperature drop from the peak or say 215dg C for ref down to probably about 150 an
Electronics Forum | Mon Jul 12 05:54:34 EDT 2010 | xps
Hi everyone, someone knows the correct parameters for reflow the smt devices using SnPb on ENIG finishing ? Someone suggest to use more temperature than others finishing, cause nickel barrier. Someone can confirm this ? There are handbooks or articl
