Electronics Forum | Wed Apr 16 15:38:46 EDT 2008 | ck_the_flip
This person needs to have the "mental faculties" and a basic understanding of science, and understand concepts like flux, solder paste, time vs. temperature curves, etc. Do they have to be a metallurgist?? Of course not, but at the minimum they hav
Electronics Forum | Fri Jan 13 06:43:20 EST 2006 | cyber_wolf
How would you like to have this guy evaluate your reflow profile? It was in response to an auditor who require someone they had monitor temperature in both Fahrenheit and Celcius. What a geek Don't put him on the spot. That is not a good thing to
Electronics Forum | Sun Apr 25 11:30:12 EDT 1999 | Earl Moon
| Hello all, | | Our guys here still have some questions on the "optimized" profile which sees a more moderate ramp up straight to reflow temperatures versus the conventional profile which has a plateau at around 150 Celsius. If the optimized profi
Electronics Forum | Sun Apr 25 12:24:45 EDT 1999 | Chrys Shea
| Hello all, | | Our guys here still have some questions on the "optimized" profile which sees a more moderate ramp up straight to reflow temperatures versus the conventional profile which has a plateau at around 150 Celsius. If the optimized profi
Electronics Forum | Sun Apr 25 14:43:34 EDT 1999 | Earl Moon
| | Hello all, | | | | Our guys here still have some questions on the "optimized" profile which sees a more moderate ramp up straight to reflow temperatures versus the conventional profile which has a plateau at around 150 Celsius. If the optimized
Electronics Forum | Mon Apr 26 16:39:46 EDT 1999 | JohnW
| | Hello all, | | | | Our guys here still have some questions on the "optimized" profile which sees a more moderate ramp up straight to reflow temperatures versus the conventional profile which has a plateau at around 150 Celsius. If the optimized
Electronics Forum | Wed Apr 21 11:33:20 EDT 2004 | tigerlordgm
As one of our small batch processes, we place BGAs on PCB without using solder paste. We apply tacky flux to a predetermined height on a pallet, "dip" the BGA into the tacky flux to wet the solder balls to the set height, and then use a BGA rework st
Electronics Forum | Tue Sep 11 12:45:01 EDT 2007 | rgduval
Both questions will depend upon the IC specifications. Check the manufacturers recommendations for temperature specification, as well as reflow profiling. As a general rule, we don't like to rework a component more than 2 times after initial reflow
Electronics Forum | Mon Jan 26 15:09:59 EST 2009 | leemeyer
IPC 7530 - Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
Electronics Forum | Mon Jan 26 11:58:06 EST 2009 | ghcarnu
Hi there, where can I find some hints about placing the temperature sensors on the pcb when determining the reflow profile? I'm interested especially in the case of a pcb having BGA's. Thanks for your answers ! gheorghe
