Electronics Forum | Tue May 13 21:08:24 EDT 2003 | ramanandkini
Dear Sir, Sorry for the delay in reply. This is regarding MIL standard for bond pull strength: MIL-STD-883C dt.25/08/83 Bond strength (destructive bond pull test); refer table-1 Minimum bond strengths for various wire composition & diameter given.
Electronics Forum | Mon Mar 03 10:38:28 EST 2003 | davef
Electroplated nickel and electroplated gold is the more �traditional� finish for aluminum wire bonding. That surface was an extension of gold thermosonic wire bonding that requires a thick [50 thou min] gold surface. For years fabricators recommend
Electronics Forum | Mon Mar 17 10:36:04 EST 2003 | davef
Ramanandkini 14 gm versus 5 gm: 14 gm [even 10 gm] sounds better than 5 gm. We get good bond pull XBAR (high teens) and low sigma (
Electronics Forum | Sat Mar 15 20:24:13 EST 2003 | ramanandkini
Thanks Mr.Dave. Sorry for the delay. One of our major prolems in ENIG plated surface is that wire does not stick. For many years we were getting a bond strength of 14 grams in both ENIG and electroplated surfaces. Now one vendor supplies ENIG boards
Electronics Forum | Sun Mar 02 12:16:29 EST 2003 | ramanandkini
Recently, one of our new vendor supplied us PCBs with Electroplated Nickel and Gold. We have the other regular source giving us ENIG plating. In both the wirebonding quality is OK. How do we benchmark this? Which one is suitable for production with l
Electronics Forum | Sun Mar 02 17:40:02 EST 2003 | MA/NY DDave
Hi It sounds like you are in a different country or in the USA a long time ago. I have no idea of the process either is using, so they can be comparable or one can be better than another and lop sided compared to other places. Benchmarking I think
Electronics Forum | Tue Nov 15 09:31:27 EST 2005 | arclightzero
I have been reading a good deal about IMC (purple plague in particular) in gold wire/aluminum pad wire bonds. My company uses ultrasonic wedge bonding, and for the most part all of our bonding is gold/gold, however we have one particulr part that has
Electronics Forum | Mon May 07 22:29:52 EDT 2001 | davef
4 wire per sec ... you figure how many you need] Encapsulation ~$120K for a dispenser [10 sec per die ... you figure how many you need] plus a cure oven ~$100k Throw in a another ~$100k for marking and cleaning Check the September 2000 SMTnet New
Electronics Forum | Mon May 07 11:02:17 EDT 2001 | Singh
Hi all. I am looking into the implementation of the Chip on Board process with eutactic bonding and the then using either gold or aluminum wire to make wedge type wire bonding. Since I am totally new to this, can somebody guide me thru the process,
Electronics Forum | Sun May 26 10:21:46 EDT 2002 | V.RAMANAND KINI
We buy PCBs for aluminium wire bonding. Our PCBs have 0.25 mm square pads for bonding and 0.10 or 0.15 mm gap between circuit traces/tracks. We do not have any problem. Our vendor gives 9 microns of Nickel and 0.03 microns of gold.
