Electronics Forum | Wed Jul 29 10:46:04 EDT 2009 | babe7362000
I was wondering if anyone knows the best way to clean oxides off of fine pitch components? Apparently the paste we use does not have strong enough flux to remove the oxides off of the leads of the components. I have validated the profile and that i
Electronics Forum | Thu Feb 15 16:01:53 EST 2007 | jdengler
Bert, Clean the emitter disk of the nozzle you use for this part. Set everything in the PD back to where it should be and set the "Lead_check_area" to 10. This will look at 10% of the end of the leads. This will help if the leads do not have even
Electronics Forum | Mon May 26 11:02:17 EDT 2008 | jandon
Hi Mr. Necdet Ozyonum, Recently we did have same kind of problems when we use lead free reflow profile for leaded solder paste (AIM WS-483). There where solder resist lacks, we found white residue after aqueous cleaning. Not in the solder joints but
Electronics Forum | Wed Oct 30 02:37:58 EST 2002 | Dreamsniper
Hi Guys, I have a fine pitch QFP that I suspect of having a solderability (wetability) problem. The heel joint is 50%-75% of the lead thickness so it means that I passed the IPC Class 2 recommended criteria on the Heel. The toe has at least 25%-50% s
Electronics Forum | Wed Sep 01 12:58:42 EDT 2010 | scottp
A good paste will print fine up to 5 in/sec or so. They key, as mentioned, is to get the pressure right for a given squeegee speed. If the squeegees aren't giving a clean wipe then you'll see huge variation in print volume which can lead to shortin
Electronics Forum | Wed Feb 24 12:53:55 EST 1999 | Dave F
| Are the terms "uBGA" and "Fine Pitch BGA" synonomous, different all-together, or is Fine Pitch BGA a subset of uBGA? Thanks. | | Steve | Steve: �BGA�: Micro BGA�. A brand name for a fine pitch BGA from Tessera. Fine Pitch (1) In SMD: Surfa
Electronics Forum | Tue Jun 13 21:57:01 EDT 2000 | Dave F
Todd: You say: "... solder masking between the lands of fine pitch components can cause stenciling problems and or manufacturing problems." I say: Fine pitch components without solder masking between the lands can cause stenciling problems and o
Electronics Forum | Tue Sep 21 08:49:59 EDT 1999 | Chad Notebaert
| | My stencil thickness is 6 mil and we got qfp's with fine pitch. | | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | | | thanks | | | We use 6 mil lasercut stencils with 15% redu
Electronics Forum | Wed Mar 09 16:53:01 EST 2011 | davef
Do NOT use ICs with lead pitch
Electronics Forum | Thu Nov 30 17:00:59 EST 2000 | Charles Morehouse
I am interested to know what people prefer for fine pitch packaging. Tape/Reel or Waffle tray for .031", .025", .020", .015" pitch components? What is the most robust packaging (i.e. fewer bent leads, etc.) Chuck
