Electronics Forum | Fri Jun 09 10:14:38 EDT 2006 | pjc
The leads may be that Alloy 42. I would look to be sure your peak temp at reflow is over 220C, like 222C is nice. Also check that time-over-liquidous is meeting solderpaste mfrs. specification.
Electronics Forum | Fri Dec 01 16:02:33 EST 2000 | Jim M
Thanks for your reply. I 've tried to clarify and answer your questions. The water soluble paste used is WS3060, type 4. The boards are sent through a inline di cleaner after reflow. There is a hot Di waterwash, rinse and then hot air to dry the wa
Electronics Forum | Tue Jun 13 16:45:30 EDT 2006 | adlsmt
If the only difference is the layer count, check the profile as stated above. If you dont have a profiler you can probably get the local Kic or Mole rep to do a demo on that board. I believe I was the one who stated in an old post that prying the lea
Electronics Forum | Tue Jun 13 17:16:44 EDT 2006 | slthomas
"I believe I was the one who stated in an old post that prying the leads is rediculous." I have been down this road as well. The prez of my previous employer decided that because he could pry .012" leads off the pads with a screwdriver that we had a
Electronics Forum | Fri Jun 09 15:41:59 EDT 2006 | shawnvike
That is the problem I am having! Except with 3 separate manufacturers. To answer some of the other questions... Baking - diligence Stencil - as far as we can tell it is good Placement is good We are using Pb-free parts and solder, but I have see
Electronics Forum | Fri Jun 09 12:13:11 EDT 2006 | Chunks
Rob and Pete are both right. "We" had the same problem, with just one manufacturer of the same style QFP (don't want to name names here). We had the same style of QFP from a different manufacture right next to the problematic one on about 3 product
Electronics Forum | Fri Jun 09 05:18:07 EDT 2006 | Rob
Hi Shawn, that you're baking the components makes me think that they are either old, or have been sitting around for a while (or none of the above & you are really dilligent!) Whilst baking will sort out the MSD issues (such as popcorning) it will
Electronics Forum | Wed Jun 14 11:37:44 EDT 2006 | shawnvike
find the problem? Were the parts failing > electrically? Or did someone start prying them > and decide they were too weak? Originally found the problem going through some older assemblies that had failed testing. Poked at leads and found them no
Electronics Forum | Wed Sep 04 22:48:13 EDT 2013 | winson16
SMT fine pitch connector having oxidation on lead and P&P machine keep rejecting the part. Is there any alternative way to reduce the part throw out rate without jeopardize the placement accuracy? Or is it possible to re-coat the connector lead or an
Electronics Forum | Fri May 28 16:30:39 EDT 1999 | JohnW
| Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. | | Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect
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