Electronics Forum | Mon Feb 03 23:49:00 EST 2003 | Dreamsniper
Hi, Has anyone who's using vapor phase process able to help me troubleshoot tombstoning? I raed about uneven forces during reflow due to misalignment, pad design, paste volume deposition unevenness due to dirty stencils, worn stencil printer parts s
Electronics Forum | Wed Aug 08 12:14:26 EDT 2012 | jorge_quijano
Hi, We have a client requiring us to use a Vapor Phase Reflow Oven instead of our convection oven, the new PCB design will be ~9.3mm thick with some SMD & Pressfit connectors, does the PCB thick could be the cause of they requiring us the Vapor Phase
Electronics Forum | Wed Mar 19 20:40:27 EST 2003 | arminski
Vapor Phase process can do reflow from 4 to 5 times!
Electronics Forum | Fri Aug 26 11:22:07 EDT 2005 | GS
Have you considered to use Vapor Phase Reflow(Condensation) ? Regards GS
Electronics Forum | Tue Jun 17 09:06:33 EDT 2008 | ldavis
We've had very few tombstone problems but all were fixed by reducing the apertures of the affected components.
Electronics Forum | Sat Apr 18 05:09:08 EDT 2009 | alfred
I have a solution.... contact me by mail Vapor phase gives a solution to that problem
Electronics Forum | Wed May 05 10:00:41 EDT 2010 | stepheniii
Why do you want a vapour phase oven? Why not a batch convection oven?
Electronics Forum | Tue May 03 12:26:43 EDT 2011 | cyber_wolf
Your solder paste supplier can give you a recommended profile.
Electronics Forum | Thu Jun 12 10:26:27 EDT 2014 | jax
For Vapor Phase: approximately .04 bar or 30 torr for around 10 seconds.
Electronics Forum | Mon Sep 16 15:39:10 EDT 2019 | capse
R&D is now part of IBL. The tech support number for the US is 407-593-0126
