Electronics Forum | Thu Sep 08 07:04:02 EDT 2005 | davef
Finer pitch: Wedge bonding can be designed and manufactured to very small dimensions, down to 50 mm pitch. Processing speed: Machine rotational movements make the overall speed of the wedge bonding process less than thermosonic ball bonding. Alumin
Electronics Forum | Tue Jul 18 03:52:57 EDT 2000 | Jeff Sanchez
Dave, I will take a stab at this. Haveing not had the opertunity to be stuck in such a jam. I would take a piece a aluminum and cut out a whole the size of the shield.The aluminum plate should be the size of the board or larger. Use stand offs to
Electronics Forum | Tue Feb 19 10:47:47 EST 2019 | rgduval
I'm with Steve. Check the datasheet, and make sure that the terminations are meant for solder application, and not conductive epoxy. I had that happen a year or so ago with an MLCC. Drove us nuts for two days (not to mention the significant rework
Electronics Forum | Mon Nov 05 20:31:09 EST 2001 | davef
Most people do not intend to �solder� Type K thermocouples. They use solder to �attach� the thermocouple. Search the fine SMTnet Archives for a posting by Chrys Shea. 1 Common thermocouple types commonly used for thermal profiling are: * Type K �
Electronics Forum | Tue Feb 19 19:36:21 EST 2002 | davef
You weren�t clear but I assume the problem is not widely distributed and affects only a few parts on each board. Do this trick: * Cut a ~1� piece of fairly serious wire, like 18 or 12 AWG. * Strip the insulation. * Gear-up with gloves, glasses, and
Electronics Forum | Thu Jul 29 11:58:06 EDT 1999 | Greg Jones
| | | | Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | | | | | | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead e
Electronics Forum | Mon May 14 17:12:20 EDT 2001 | davef
Continuing along the path that Brian took ... IPC-7525 gives design guideline for stepped stencils. It goes something like: * Stepped area SB GT 25 thou from pads located on the greatest thickness of the stencil * Pads in stepped area SB GT 35 tho
