Electronics Forum | Fri May 11 10:30:26 EDT 2001 | rkevin
I am looking for info. (pro and con) and/or 1st hand knowledge processing PCB's with Immersion Tin finish through SMT and Wave. Do profiles need to be different? Solderpaste considerations? Anything else? In the past I have experienced selective non
Electronics Forum | Mon May 14 09:24:36 EDT 2001 | rkevin
Can anyone shed some light on this for me ? Subject: Soldering to Immersion Tin surface finish I am looking for info. (pro and con) and/or 1st hand knowledge processing PCB's with Immersion Tin finish through SMT and Wave. Do profiles need to be di
Electronics Forum | Thu Jul 22 20:41:11 EDT 2004 | C.W
hi All, i have recently running a Ceramic board with silver/palladium surface finish, using Alpha Metal 63/37 WS solder paste, soldering meet IPC standard after reflow, however, the solder joint look grainy, not sure if there could be too much interm
Electronics Forum | Sat Jul 24 01:52:31 EDT 2004 | C.W
thanks Dave!!
Electronics Forum | Fri Jul 23 09:12:34 EDT 2004 | davef
We have run not AgPd [that we know of]. We can comment on PdNi. [But you're probably have Ni under the AgPd] In general, palladium solution rate is much slower than other sacrificial finish materials that we use for the purpose. The key then is to
Electronics Forum | Tue May 15 11:55:16 EDT 2001 | dason_c
We had a same problem before and Cirtech work with FAB supplier. It is due to the contamination on the tank. No special profile and paste use on the immersion tin board. Dason
Electronics Forum | Sat Jul 31 08:14:43 EDT 2004 | sforman1
Your liquidus time is too long. 63/37 is a eutectic so leave at liquid state a very short time SF
Electronics Forum | Mon May 14 17:14:07 EDT 2001 | davef
First, consider checking the fine SMTnet Archives. Look for threads on "white tin", in addition to "immersion tin". We�ve had a cuppla good ones of late. Merix [http://www.merix.com] gives a good comparison of different solderability preservatives
Electronics Forum | Thu Jan 22 08:48:42 EST 2004 | patrickbruneel
Kris, You will need to change your probes to "bite" into the surface twisting probes specialy designed for copper surfaces. The surface hardness of copper is a lot higher compared to tin. link to article from osp manufacturer (see page 5) http://www
Electronics Forum | Fri Jan 28 13:49:48 EST 2022 | jseewald
That is correct. This looks like a board that was printed then wiped but not washed. Solder spheres left out on an unsolderable surface will just sit there like this or coalesce into solder balls. Nothing in the picture indicates an issue with the
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
Training Provider / Events Organizer / Association / Non-Profit
6600 City W Pkwy
Eden Prairie, MN USA
Phone: 952-920-7682
