New ALPHA� Fluxes meet the challenges of both tin-lead and lead-free processes. ALPHA� EFSeries fluxes offer environmentally friendly benefits, while providing unmatched soldering performance. The ALPHA� flux line is unsurpassed in providing wave sol
Our Tacky Flux includes No-Clean and Water-Solube types, only for dispensing ( named of Soldering Flux) in Back-End Ball-Attach process, and SMT & BGA repair or rework, PoP, Stud Bumping (Golden Bumping) etc, Key benefit : 1) regular flux shot and
New Equipment | Assembly Services
S-Bond has been licensed as a supplier and provider of ultrasonic activated joining services using EWI SonicSolder®, an EWI patented* binary lead-free solder alloy that melts at 231°C. In conjunction with ultrasonic soldering, it can be used to join
As the first commercially available adhesive to address the emerging surface-mount market in the 1980s, Loctite Chip bonder and Eccobond products today are the industry standard for mixed-technology and double-sided surface mount technology (SMT) app
New Equipment | Cleaning Equipment
SMT Stencil Rolls - nonwoven material (cellulose/polyester blend, SBPP) - extremely durable - high wet strength - silicone free - exceptionally low lint - material suitable for vacuum,non-vacuum or combination of both systems - also available in othe
New Equipment | Solder Materials
Fluxes for use with Tin/Lead Solder. EQ-392 No-Clean is a homogeneous mixture of halogenfree, low solids organic flux designed for wave-soldering conventional and surface mount PCB assemblies. EQ-392 provides superior foaming characteristics with a
New Equipment | Solder Materials
RA-301 is a fully activated rosin-based flux formulation containing 35% solids. RA-301 has a very wide process window, which makes it an acceptable alternative to a variety of environments and process applications. RA-301 has a high activity level th
New Equipment | Solder Materials
8 hours in controlled environment) Prints consistently at a wide range of speeds Wide reflow process window for profiling Excellent wetting on a variety of surface finishes Maintains tack over time Suitable for SnPb eutectic alloys as well
New Equipment | Solder Materials
Shenmao Technology offers a full line of Water Soluble Fluxes and Water Soluble Solder Paste for SMT and IC packaging applications. We provide halide-containing and halide-free fluxes for Tin/Lead as well as Lead-Free solder alloys. Our formulations,
New Equipment | Solder Materials
YINCAE is excited to announce that we have successfully developed a new No Clean Flux product - NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping a
