New SMT Equipment: vacuum void (Page 1 of 3)

Beijing TORCH RS220 vacuum Reflow Oven for Lamp Welding / IGBT / Power Laser / Semiconductor laser with 1% void rate

Beijing TORCH RS220 vacuum Reflow Oven for Lamp Welding / IGBT / Power Laser / Semiconductor laser with 1% void rate

New Equipment | IC Packaging

Function Introduction: 1. TORCH promotes a new Vacuum Reflow Oven in RS series which is the third generation of its small Vacuum Reflow Oven. It especially designed for the fields in small batch production, R&D and functional materails test, etc

Beijing Technology Company

ERSA EXOS 10/26, Inline reflow soldering with vacuum

ERSA EXOS 10/26, Inline reflow soldering with vacuum

New Equipment | Reflow

With the EXOS 10/26, Ersa offers a vacuum reflow soldering system with eleven heating zones, three heating circuits for the vacuum chamber and four cooling zones for extremely voidfree connections in electronics production. The absolute highlight

kurtz ersa Corporation

SMT Vacuum Reflow Oven

SMT Vacuum Reflow Oven

New Equipment | Reflow

Inclusions/voids will be reduced up to 99% Vacuum process can be switched on or off Nitrogen and air soldering possible Double sided PCB possible Pass through height: 30 mm (top and bottom) Small PCB with carrier Setting parameter: Time until sub-pre

DOUYEE Enterprise

High Quality Vacuum  Reflow Soldering Oven KD-V43 with 100% Hydrogen, Nitrogen Or  Hydrogen Forming gas ,HCOOH

High Quality Vacuum Reflow Soldering Oven KD-V43 with 100% Hydrogen, Nitrogen Or Hydrogen Forming gas ,HCOOH

New Equipment | Soldering - Other

Sunny Company:Beijing Chengliankaida Technology Co.,Ltd  Address : SanCang Road Sanjianfang airport ,Tongzhou district , Beijing China  Email: salemachines@bjclkdkj.cn  Skype :smdsupplier Whatsapp: +86 159 01434496 Wechat: + 86 159 0143 4496  

Beijing Chengliankaida Technology Co.,Ltd

Big-Size Vacuum Soldering Oven  for IGBT, MOS

Big-Size Vacuum Soldering Oven for IGBT, MOS

New Equipment | Solder Materials

              Big-Size Vacuum Soldering Oven  for IGBT, MOS 1.Reflow soldering   Typically high number of voids cause a large non conductive area 2.Vacuum soldering  Very low number of voids, Typically 3.Applications Power Semiconductors;Hybrid

Beijing Chengliankaida Technology Co.,Ltd

Pyramax Vacuum Reflow Oven

Pyramax Vacuum Reflow Oven

New Equipment | Reflow

Vacuum Reflow for High-Volume Manufacturing The Pyramax Vacuum reflow oven has been designed with the requirements of large EMS/high-volume automotive customers in mind. The unit is configured with 10 zones of closed-loop convection heating and a ma

BTU International

SEHO MaxiReflow - HP High-End Reflow Oven

SEHO MaxiReflow - HP High-End Reflow Oven

New Equipment | Reflow

Innovative technology for virtually void-free reflow soldering processes. Particularly suited for demanding applications. Whether for power electronics, electronic aviation systems, medical equipment or electronic systems for the automotive industr

SEHO Systems GmbH

Asscon VP6000 with Vacuum

Asscon VP6000 with Vacuum

New Equipment | Reflow

ASSCON’s vacuum soldering process combines the average of the vapor-phase with the vaccum process. The vaccum module consists of the evacuation unit mounted in the process chamber where it is secured with quick-locks for fast and easy removal f

A-Tek Systems Group LLC

Vacuum SMT Reflow Oven KC-Z104

Vacuum SMT Reflow Oven KC-Z104

New Equipment | Reflow

Vacuum SMT Reflow Oven KC-Z104 PCB: 400mm*350mm 10 heating zones Weight APPROX:2500KG Dimension L6025×1350×1500mm Product description: Vacuum SMT Reflow Oven KC-Z104,China factory manufacturer directly. PCB: 400mm*350mm, 10 heating

Flason Electronic Co.,limited

Vacuum Reflow Oven KC-Z104

Vacuum Reflow Oven KC-Z104

New Equipment | Reflow

Vacuum Reflow Oven KC-Z104 PCB: 400mm*350mm 10 heating zones Weight APPROX: 2500KG Dimension: 6025×1350×1500mm  INQUIRY Vacuum Reflow Oven KC-Z104 Specifications: The Vacuum Reflow Oven Soldering theory is make a vacuum environment at the

Fomyn Equipment co,.ltd

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