ASCEN PCB depaneling machine as pcb separation equipment mainly use for the PCB assembly in the large mass production with the high efficiency and save a lots of labor for the manufacturer. Most of time, one set of this type PCB cutting machine&
ASCEN PCB depaneling machine as pcb separation equipment mainly use for the PCB assembly in the large mass production with the high efficiency and save a lots of labor for the manufacturer. Most of time, one set of this type PCB cutting machine&
ASCEN PCB separator can cutting up to 20 PCBs simultaneously, it mainly use for the PCB assembly in the large mass production with the high efficiency and save a lots of labor for the manufacturer pcb separator Features: 1.This PCB cutting
Advanced Solder Paste SMT Stencil Printer ❙ Introduction of SMT Printer I.C.T-4034 is a high precision automatic solder paste printer, correspond to industrial 4.0 and MES system.through a higher level of automation, achieve zero defect. 1. High
Efficient SMT Automatic PCB Solder Paste Printing Machine - Seamless Circuitry Assembly ❙ Introduction of SMT Printer 1. High positional accuracy, repeated positioning accuracy ±0.01mm; printing accuracy 0.025mm. 2. Support glue printing,Automat
PCBA V-cut machine F886 automatic v-groove pcb cutting machine Features ▶HMI touch screen control, simple operation, training can be mastered and used. ▶PLC+ servo motor control, stable and reliable performance, higher repeatability. ▶The width of t
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PCBA V-cut machine F886 automatic v-groove pcb cutting machine Features ▶HMI touch screen control, simple operation, training can be mastered and used. ▶PLC+ servo motor control, stable and reliable performance, higher repeatability. ▶The width of t
ZMD820 Standard Online AOI Inspection solution Feature ▶Flexible/multi-purpose AOI. ▶Vector analysis algorithm to achieve the best detection capability. ▶German brand 5 million pixel industrial camera. ▶The whole board is matched with multiple detec
ASCEN Automatic stencil printer greatly improve its accuracy and performance. Now the design of the circuit substrate is fine and small.Most electronic product manufacturers in the market are switching to automatic or fully automatic solder past
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