New Generation of Video Microscope for High Quality and Reliable Visual Inspection of solder joints of BGA, uBGA, CSP and Flip-Chip packages. Connecting it to your PC or Laptop to utilize benefits of Digital Image Capture, Measurements and Data Manag
40mm Applications Solder Joint Quality (BGA, Leaded) Bridging Voiding Opens Bare boards (Inner layers, traces, vias) Component Package Inspection (wire bonds) Subtle Defect Inspection
Motor-driven MDS-508-500/509-500 separates v-scored PCBs without stress to boards, components or solder joints. it is suited for medium to high-volume production, Cut length is fully programmable; programmed length is displayed on an LED readout.
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AI-powered AOI Solutions Reduce False Calls and Escapes LEARN WHY MORE THAN ONE IN THREE AOI MACHINES INSTALLED IS FROM KOH YOUNG AI-powered True 3D AOI Solutions from Koh Young help manufacturers achieve zero-defect Production. The portfolio of A
New Equipment | Solder Materials
KappZapp4™ contains 4% Silver (Ag), and is often preferred for hand soldering Copper wires and tabs. It has a wider slushy or plastic range (430°F-475°F and 221°C - 246°C) to allow users to manipulate parts while the solder joint is cooling and harde
New Equipment | Rework & Repair Equipment
The TMT-9000S is based on Curie Heat Technology which responds to the thermal demands of each solder joint by adjusting the power instantaneously, thereby meeting the exact requirements of the substrate component and solder material. High thermal
New Equipment | Solder Materials
AMTECH’s Premium Bar Solder is designed to meet today’s sophisticated electronic manufacturing processes by providing a strong and reliable solder joint. All AMTECH bar solder is manufactured from a variety of high purity virgin metals that exceed th
New Equipment | Rework & Repair Equipment
The TMT-5000S is based on Curie Heat Technology which responds to the thermal demands of each solder joint by adjusting the power instantaneously, thereby meeting the exact requirements of the substrate component and solder material. Curie Heat Te
New Equipment | Rework & Repair Equipment
The TMT-2000S is based on Curie Heat Technology which responds to the thermal demands of each solder joint by adjusting the power instantaneously, thereby meeting the exact requirements of the substrate component and solder material. Curie Heat Te
Jet printing for high mix production The MY500 Jet Printer is a breakthrough innovation. Well proven on five continents, it shoots solder paste on the fly at split-second speeds while moving above the board. The MY500 is designed to keep pace with
