New Equipment | Education/Training
Now updated to Revision F of the latest IPC-A-610F and J-STD-001F – the IPC Training & Reference Guide illustrates critical acceptance criteria for the evaluation of surface mount solder connections. With 44 pages and a compact 5.5 x 8.5 inch (14 x
Solder Joint Inspection and Measurement System, for both pre and post reflow applications
SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical and
New Equipment | Soldering Robots
Reduce Risk and Increase Productivity with Robotic Soldering Metcal’s Robotic Soldering System with patented Connection Validation (CV) technology and a touchscreen graphical user interface is designed to drastically mitigate the risk of solde
BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. During
New Equipment | Education/Training
Now updated to Revision F of the latest IPC-A-610F and J-STD-001F – the IPC Training & Reference Guide illustrates critical acceptance criteria for the evaluation of through-hole solder connections. With 30 pages and a compact size at 5.5 x 8.5 inch
Solder joint inspection of bottom-side PCBs Intelligent Inspection of Solder Joints, THT and SMD Components Today, the industry standard quality assurance in electronics production is automatic optical inspection (AOI) of SMD components on printed
The revolutionary Ersascope 3000 optically inspects hidden solder joints without the limitations of X-ray. See solder joints in color, measure stand-off heights, radius, and angles. Add text to images and save in databases or email to suppliers. T
The OptiCon THT-Line AOI system provides a parallel inspection of THT components and THT solder joints. In a typical THT production line, it is possible to inspect mounted components before the soldering processes as well as PCB solder joints during
3D BGA inspection system to inspect BGA solder joints, capture defect images for documentation, easy to use, low cost, latest camera technology.
