Description: TEMT6000 is a silicon NPN epitaxial planar phototransistor in a miniature transparent mold for surface mounting onto a printed circuit board. The device is sensitive to the visible spectrum. FEATURES Adapted to human eye responsivity
Specifications: Features: Miniature and Low profile capacitor. Mountable by and automatic placer. Re-flow soldering applicable. Easy adjustment by using a conventional screw driver. Specifications: Operating Temperature Range: -25 to +85 Degre
Our company professionally manufacture products are both excellent in quality and reasonable in price! Our products had been approved by UL and certificated for ROHS compliance. Our quality system had been certificated and met the requirements of ISO
LeadTracer-RoHSTM XRF System is designed specifically for screening of all RoHS/WEEE and Common Elements in electronics including China RoHS. Isotope based design for generation of entire x-ray energy spectrum Clear K-shell characteristic x-rays
The EDX-720 is a high-performance general-purpose instrument with several features optimized to enhance performance for demanding regulatory compliance measurements such as RoHS and ELV. The EDX-720 is equipped with the following standards features:
As an industry leader, IDENTCO understands that high speed automatic application equipment requires a precisely manufactured part that contributes to static free assembly. With nearly 25 years experience, IDENTCO can design and produce die cut parts
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IDENTCO has developed a printing system that reliably produces millions of precision printed micro labels on film liners wound onto anti-static reels for hand or auto-apply equipment. IDENTCOs high performance label materials and ribbons are designe
PCB Assembly 9 SMT lines and 2 DIP lines Min.Chip size:0201 BGA and Bonding are available ROHS compliance Can buy components for customers Capability: 4 million chips can be assembled each day. Our sub-factory one offer PCB assembly service.
Design Assistance Printed Circuit Board Assembly Prototyping & New Product Introduction (NPI) High-mix/low-volume Medium-mix/medium-volume Electro-Mechanical Assembly Cable assembly Sub-assembly – i.e. Chassis assembly and wiring Full system assembly
Process Capability: Several professional auto Siemens series Siplace SMT placement and the plated-through-hole(PTH) insertion parts, test, package lines Productivity: mount above 1.5million/day SMC components in our SMT production lines Small SMC/
