The Helios™ SD-960 Series is developed for medium to large volume dispensing applications in Electronics Assembly, like Thermal Interface Material (TIM), Potting, Gasketing and Sealing. The new Helios™ SD-960 Series (SD-960) handles a broad range of
Our companion subscription includes: Sales orders. Assemblies. Best-in-class QuickBooks integration. 2 users included. $20 each additional user. $59.95/month Detailed Features: FIFO, LIFO, Weighted Average Valuation Options Multi-currenc
The IntelliJet® Jetting System with patented ReadiSet™ Jet Cartridge delivers cutting-edge reliability and micro dot dispensing for manufacturing advanced semiconductor and mobile electronics packages The piezo-driven IntelliJet system is the world'
Counterfeit components screening is the investigation of components that are not performing as compared to the respective data sheet and/or have come from an unqualified or uncertified distributor. We can assist in the analysis of counterfeit compon
New Equipment | Test Equipment
High-performance SBC Refurbished – Good Condition Manufacturer – Motorola 133 MHz MC68040 32-bit microprocessor with 8KB of cache, MMU, and FPU Full 32-bit master/slave VMEbus interface High-performance DMA supports VMEbus D64 and local bus
New Equipment | Test Equipment
High-performance SBC Refurbished – Good Condition Manufacturer – Motorola 133 MHz MC68040 32-bit microprocessor with 8KB of cache, MMU, and FPU Full 32-bit master/slave VMEbus interface High-performance DMA supports VMEbus D64 and local bus
A semiconductor is a material that conducts electricity between a conductor and an insulator at normal atmospheric temperature. Common semiconductor materials contains silicon, germanium, gallium arsenide, etc. Silicon is the most influential in the
A reader, an electrical tag and data management system constitute an integrated RFID system. Radio Frequency Identification (RFID) is also regarded as a type of automatic identification technology. It carries out non-contact bidirectional data commun
S8, S10, S12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con
E8, E10, E12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con
