New SMT Equipment: fine pitch (Page 3 of 29)

2460-V Automatic Ball Bonder

New Equipment |  

Automatic Ball Bonder for high pin count devices, complex multichip modules, fine-pitch hybrid microcircuits, ceramic circuit boards,Chip-on-board, and Chip-on-flex.

Palomar Technologies

FGI Inc.

New Equipment |  

Electronic Contract Manufacturer located in Huntsville AL. Capable of placing BGA's, and fine pitch devices.

FGI Inc.

Electronics Manufacturing Services

New Equipment |  

Printed circuit board assembly, Fine Pitch BGA, system level assembly and logistics services.

ITS

PrinTEK Ultra-Fine Pitch Benchtop SMT Stencil Printer

PrinTEK Ultra-Fine Pitch Benchtop SMT Stencil Printer

New Equipment | Printing

A highly refined and capable Ultra-Fine Pitch printer suited for all types of Fine Pitch SMT production. PrinTEK I MP-1818 embodies Transition Automation’s 20+ years of expertise in Fine Pitch SMT printing and squeegee design to give users an unpara

Transition Automation, Inc.

SMT Step Stencils

SMT Step Stencils

New Equipment | Solder Paste Stencils

Stentech has the technical ability to manufacture step stencils in both single process and dual process. Today's complex PCBs with the various components require different solder paste volumes. Stentech has the technical expertise to optimize the ste

Stentech

Design and Manufacturing with SMT Surface Mount Technology

New Equipment |  

The objective of this course is to identify the technical issues in Through hole, SMT, BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of mixed assembly electronics products. The course mat

Ray Prasad Consultancy Group

3M Flexible Circuit Foundry

3M Flexible Circuit Foundry

New Equipment | Assembly Services

3M Flexible Circuit Foundry business is one of the largest of its kind in the world. With more than 25 years of flexible printed circuit (FPC) development and manufacturing, 3M is able to turn your designs into mass-produced flexible circuits and del

3M Electronics Materials Solutions Division

Sniper Flo-master

Sniper Flo-master

New Equipment |  

The Sniper SMD-7007 combines the reflow operation of the Flo-master with the latest technology in optic and alignment design. It provides absolute control in positioning all ultra fine pitch QFP, CSP, BGA, uBGA, Large Ceramic or plastic BGA devices

A.P.E. South

Semi-automatic screen printer; No need electrical power supply- Compressed air supply only-patent pending

Semi-automatic screen printer; No need electrical power supply- Compressed air supply only-patent pending

New Equipment |  

Model ; SA006 ; high accurate & durable semi-automatic screen printer for fine-pitch printing for various substrate like PCB, FPCB, LTCC, etc..

In-Tec Supply Co.

Hi-tech placement machines

Hi-tech placement machines

New Equipment |  

We use only the Hi-tech placing machines for our production. Our production capacities : 40.000 comp. per hour. We are able to assemble following SMD components : 0201 Chip, BGA(45x45), uBGA, Best fine pitch QFP, SMD Connectors, etc.

Elcom s.r.o.


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