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http://www.flason-smt.com/product/Yamaha-Flip-Chip-Bonder-and-Hybrid-Placer.html Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product des
http://www.flason-smt.com/product/Yamaha-Flip-Chip-Bonder-and-Hybrid-Placer.html Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product descrip
New Equipment | Solder Materials
With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for reflow a
Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product description: Yamaha Flip Chip Bonde,Hybrid Placer, Yamaha flip chip bonding,Yamaha die bo
Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product description: Yamaha Flip Chip Bonde,Hybrid Placer, Yamaha flip chip bonding,Yamaha die bo
New Equipment | Solder Materials
Kester Tacky Solder Fluxes (TSFs) are the industrial standard for Flip Chip and BGA Sphere Attach. With viscosities optimized for high speed application and holding of a chip or sphere in place prior to reflow, Kester TSF’s enable wide process window
