319 compounds results

New SMT Equipment: compounds (Page 1 of 32)

Large / Versatile Board Processing - DS Series Dispenser

When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste

GPD Global

MS-11 3D SPI Series

New Equipment | Inspection

► Exclusive 15MP CoaXPress Camera System ► Dual Projection Shadow Free Moiré Technology ► Precision Compound Telecentric Camera Lens ► Automated Z-Height Calibration System ► Automated PCB Under Board Support System ► Precision PCB Warpag

MIRTEC Corp

MS-15 3D SPI Series

New Equipment | Inspection

MIRTEC Corp

MS-11e 3D SPI Series

New Equipment | Inspection

► Exclusive15MP / 25MP CoaXPress Camera System ► Dual Projection Shadow Free Moiré Technology ► Precision Compound Telecentric Camera Lens ► Automated Z-Height Calibration System ► Automated PCB Under Board Support System ► Precision PCB Warpage

MIRTEC Corp

MV-7 OMNI 3D AOI Series

New Equipment | Inspection

► Exclusive 15MP CoaXPress Camera System ► OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology ► Leading-Edge 12 Projection Blue DLP Technology ► Precision Compound Telecentric Camera Lens ► Eight Phase Color Lighting System ► 10MP

MIRTEC Corp

MV-9 3D AOI Series

New Equipment | Inspection

► Exclusive 15MP / 25MP CoaXPress Camera System ► OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology ► Leading-Edge 12 Projection Blue DLP Technology ► Precision Compound Telecentric Camera Lens ► Eight Phase Color Lighting System

MIRTEC Corp

MV-3L Desktop 2D/3D AOI Series

New Equipment | Inspection

► Exclusive 10MP / 18MP Camera Technology ► Precision Telecentric Compound Lens Design ► Eight Phase Color Lighting System ► 10MP / 18MP SIDE-VIEWER® Camera System ► Extremely Simple Programming and Operation ► Integrated INTELLI-BEAM® L

MIRTEC Corp