New Equipment | Board Handling - Conveyors
Printed circut board pcb conveyor belt Edge Conveyors are specifically designed for transporting PCBs, BGA flex arrays, MCMs, and ceramic substrates with electronic assembly, test, and inspection equipment. Available in standard or custom designs and
New Equipment | Board Handling - Conveyors
Printed circut board pcb conveyor belt Edge Conveyors are specifically designed for transporting PCBs, BGA flex arrays, MCMs, and ceramic substrates with electronic assembly, test, and inspection equipment. Available in standard or custom designs and
New Equipment | Board Handling - Conveyors
SMT online conveyor HD series is designed for heavy-duty applications. It works with most framing extrusion brands and has a compact profile. A gear motor directly drives each roller rail, eliminating the rail-to-rail drive shaft and permitting easy
New Equipment | Fabrication Services
Our Service PCB Assembly and PCB&PCBA design are our main business.We are able to undertake a highquality Printed Circuit Board Assembly on competitive prices and flexible conditions.We are a complete “One- Stop” resource for printed circuit board a
2KW Reflow Soldering Oven IN12 with PID Control,NSK axle bearing,Kanthal Heating wire Brief Introduction: IN12 is a newly designed and manufactured reflow oven by NeoDen Tech. It has 12 temperature zones, unique heating module de
Tianjin Advanced Electronics Co., Ltd. is one Hi-Tech company. Special in semiconductor material and brazing. Provide fine bonding wire, including COB(chip on board) Al Si1% and pure gold wire. Advanced manufacturing technology and equipment .Whole
Gold / Aluminum / Copper Bonding Wires The bonding wires is the most important material used in making electrical connections between the chip and the external circuit. It has good conductivity and corrosion resistance, and it could be used for extr
New Equipment | Solder Materials
KappAloy9™ - 91%Sn - 9%Zn - 390°F (199°C) eutectic alloy is the best solder for soldering Aluminum wire to Copper busses or soldering Copper wire to Aluminum busses or contacts. Its low eutectic melting point minimizes heating of critical electrical/
Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu
New Equipment | Assembly Services
The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to
