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Bonding Wire

Bonding Wire

New Equipment | Materials

For Wire Bonding with follow types; Au Wire Al Wire Cu Wire 

K-Net International Ltd.,Part

Viscom S6056BO

Viscom S6056BO

Used SMT Equipment | Visual Inspection

VISCOM S6056BO in like-new condition - checked by Viscom engineer and it is in a very good running condition. Wire bond inspection

Dinex LTD. Hungary

Majelac Technologies

Industry Directory | Manufacturer

Majelac Technologies offers quick turn IC assembly services, including open cavity QFN, wafer dicing, die sorting, wire bonding, BGA reballing, BGA assy, prototype assembly, fine pitch wire bonding, and more,

Inseto (UK) Ltd

Industry Directory |

Suppliers Of Microelectronics & PCB Assembly Equipment & Materials, including die bond, wire bond & test & SMT screen printers & pick and place systems.

Wire Clamp / Cutter

Wire Clamp / Cutter

New Equipment | Components

For Wire Bonding (Heavy Wire Wedge Bonding)

K-Net International Ltd.,Part

Bonding Wire

Bonding Wire

New Equipment | Components

Gold / Aluminum / Copper Bonding Wires The bonding wires is the most important material used in making electrical connections between the chip and the external circuit. It has good conductivity and corrosion resistance, and it could be used for extr

Plastlist Group

Microvision, Inc.

Industry Directory | Manufacturer

bonding equipment wire bonders

Failure Modes in Wire bonded and Flip Chip Packages

Technical Library | 2014-12-11 18:00:09.0

The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Wire bonded packages using conventional copper lead frame have been used in industry for quite some time. However, the demand for consumer electronics is driving the need for flip chip interconnects as these packages shorten the signals, reduce inductance and improve functionality as compared to the wire bonded packages. The flip chip packages have solder bumps as interconnects instead of wire bonds and typically use an interposer or organic substrate instead of a metal lead frame (...) The paper provides a general overview of typical defects and failure modes seen in package assembly and reviews the efforts needed to understand new failure modes during package assembly. The root cause evaluations and lessons learned as the factory transitioned to thin form factor packages are shared

Peregrine Semiconductor

Wedge

Wedge

New Equipment | Other

For Wire Bonding (Wedge Bonding) with follow types; Fine Wire Wedge Heavy Wire Wedge Ribbon Wire Wedge

K-Net International Ltd.,Part


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