Full Site - : wire bonder broker (Page 4 of 25)

Semiconductor Tool

New Equipment | Other

Dicer/ Wire Bonder/ Die Attached/ Prober/ Tester/ SEM/ Handler....etc.

Eurotek International

Kulicke&Soffa Industries ConnX Plus

Used SMT Equipment | Semiconductor & Solar

Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V

LEL Tech

Kulicke&Soffa Industries ConnX Plus

Used SMT Equipment | Semiconductor & Solar

Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V

LEL Tech

Kulicke&Soffa Industries ConnX Plus

Used SMT Equipment | Semiconductor & Solar

Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V

LEL Tech

Kulicke&Soffa Industries ConnX Plus

Used SMT Equipment | Semiconductor & Solar

Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V

LEL Tech

Kulicke&Soffa Industries ConnX Plus

Kulicke&Soffa Industries ConnX Plus

Used SMT Equipment | Semiconductor & Solar

Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V

LEL Tech

ASM Pacific Technology IHawk Extreme

Used SMT Equipment | Semiconductor & Solar

10 units of ASM IHawk Extreme wire bonders for sale. All the units are 2011 vintage and in good condition. For further information, feel free to contact us.

C.P Company

Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

New Equipment | IC Packaging

The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specia

Hesse Mechatronics

Leapfrog 3D Printer

New Equipment | Printing

3D Printers  Rapid Prototyping Equipment  Semiconductor Equipment - Rework Stations - Wire Bonders -  Palomars, Orthodyne, Delvotec

CSI Equipmet Sales


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