Technical Library | 2018-09-26 20:33:26.0
Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and – most notably – center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.
Technical Library | 2023-01-17 17:16:43.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2018-10-03 20:41:44.0
Voids in solder joints plague many electronics manufacturers. Do you have voids in your life? We have good news for you, there are many excellent ways to "Fill the Void." This paper is a continuation of previous work on voiding in which the following variables were studied: water soluble lead-free solder pastes, a variety of stencil designs, and reflow profiles. Quad Flat No-Lead (QFN) component thermal pads were used as the test vehicle. The voiding results were summarized and recommendations were made for reduction of voiding.
Industry News | 2016-09-07 19:04:13.0
Kurtz Ersa North America is pleased to announce that Viktoria Rawinski, Assistant to the CEO of the Kurtz Ersa Group and head of the Kurtz Ersa Company Museum and the Corporate History Department, will present the paper entitled, “Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate – Process Integration in Industrial Production,” during SMTA International. The presentation is scheduled to take place during Session MFX4, entitled, “Reflow and Soldering Technology: Void Reduction” on Wednesday, September 28, 2016 from 10:30 a.m. to 12 p.m. in Room 49.
Industry News | 2012-09-17 15:38:30.0
SEHO North America, Inc. announces that Christian Ott, Senior Sales and Project Manager, will present a paper titled “Reduction of Voids in Solder Joints …
Industry News | 2018-12-18 20:36:04.0
BTU International is pleased to announce that Fred Dimock, Manager of Process Technology, will present during the upcoming SMTA Capital Chapter Meeting. Dimock will present “Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data” at the meeting, scheduled to take place Thursday, Jan. 10, 2019 from 5-7:30 p.m. at ZESTRON in Manassas, VA.
Industry News | 2019-09-21 04:28:31.0
BTU International, Inc is pleased to announce that Fred Dimock, Manager of Process Technology, will present during SMTA International. Dimock will present “Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data” during the Jump Start - 101 Technical Session, scheduled to take place Tuesday, Sept. 24, 2019 from 10:30 a.m. - 4:15 p.m. in the Show Floor Theater.
Industry News | 2021-01-11 15:35:33.0
BTU International, Inc. is pleased to announce that Fred Dimock, manager of process technology, will host the SMTA Capital Chapter's first chapter webinar of 2021. The webinar, "Operation of a Vacuum Reflow Oven with Updated Void Reduction Data," will take place Wednesday, January 20, 2021 at 11 a.m. EST.
Industry News | 2019-01-04 16:11:03.0
KIC will exhibit in Booth #1215 at the 2019 IPC APEX EXPO, scheduled to take place January 29-31, 2019 at the San Diego Convention Center in CA. Visit the KIC booth for a reflow profiling clinic for void reduction.
Industry News | 2016-07-18 17:00:38.0
KIC today announced plans to participate in the SMTA Carolinas Chapter Tech Session, scheduled to take place Thursday, August 18th in Greenville, SC. The event will be hosted by Hubbell Lighting, Inc. MB (Marybeth) Allen will present “Optimization of the Reflow Profile to Minimize Voiding.”
