Industry News | 2010-02-17 18:45:59.0
The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference. Short course descriptions are also being solicited.
New Equipment | Soldering - Other
ASSCON Vapor Phase Soldering: ASSCON VP2100 Vacuum, ASSCON VP800 Vacuum, ASSCON VP6000 Vacuum & ASSCON VP7000 Vacuum
Industry News | 2009-01-23 19:18:23.0
You are invited to submit a paper to the electronic industry's premier forum on the manufacture of electronic products utilizing surface mount and related technologies.
Industry News | 2010-05-07 16:01:14.0
New this year! The SMTA International Technical Committee invites you to participate in a poster session at SMTA International. Poster sessions are presented on the show floor and are a great way to present current research and results in a concise manner without requiring a technical paper.
Industry News | 2015-11-25 16:58:05.0
On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.
Industry News | 2013-08-07 09:58:46.0
The SMTA launched an online re-certification program for engineers whose 10-year SMT Processes Certification is expiring.
Technical Library | 2019-05-23 10:38:07.0
Solvent and co-solvent cleaning involves the use of engineered solvents in a vapor phase system. The solvents classically used were Class 1 Ozone Depleting Substances, but new types of solvents have been developed that are less environmentally harmful. In some cases, isopropyl alcohol is used with a co-solvent. In these types of cleaning systems, a cloud of boiling vapor solvent is maintained between a boil sump and a cooling coil. When the items to be cleaned are immersed in the vapor cloud, the solvent condenses on the assemblies and acts to dissolve the residues. These processes usually involve a final rinse step outside of the vapor cloud to ensure that all dissolved residues are washed off the assemblies (Figure 1).
Industry News | 2011-01-20 13:45:14.0
IPC will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show's thirty-five technical conference sessions on April 12–14, 2011.
Used SMT Equipment | Pick and Place/Feeders
YAMAHA placement machine-YV180Xg equipment parameters: Theoretical mounting speed: 0.095 seconds/CHIP, actual 20000CHIP/H. Production PCB size: L330 x W330 ∼ L50 x W50mm / t = 0.4 ∼ 3.0mm. SMD components range: 0402∼SOP, SOJ, 84 Pin
Best-in-class thermal performance and improved sustainability, meeting the most critical and demanding reflow requirements in the industry. The Centurion™ reflow soldering oven is a forced-convection SMT reflow system with tight, closed-l
