Industry News | 2021-02-08 15:16:46.0
BTU International, Inc. will participate in the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. The company will highlight the PYRAMAX™ Vacuum reflow oven during the virtual event.
Industry News | 2019-12-16 22:31:09.0
Vacuum reflow solder is refers to the vacuum eutectic oven, vacuum in vacuum environment for high quality welding products, in the welding process of zhongtong into reducing system (N2, formic acid, N2H2, H2), to protect the product and the solder is not oxidized, at the same time the product and solder oxide on the surface of the reaction, make weld surface quality improvement, reduced the rate of welding hollow.
Industry News | 2019-12-09 06:31:52.0
Recently, the 2019 Hunan power semiconductor industry conference and the fifth international academic forum of China IGBT technology innovation and industry alliance were held in Zhuzhou, Hunan province.
With the new EXOS 10/26, Ersa GmbH presents a vacuum reflow soldering system with which the void rate can be reduced by 99%. More about the EXOS 10/26 ? https://www.kurtzersa.com/electronics-production-equipment/soldering-machines/reflow-soldering/pr
Covering the industrial chain of power semiconductor materials, chips, modules, equipment and other industries, dozens of enterprises from home and abroad participated in the exhibition. This series of products can control the welding cavity rate of
Events Calendar | Tue Nov 05 00:00:00 EST 2019 - Tue Nov 05 00:00:00 EST 2019 | North Billerica, Massachusetts USA
Free Vacuum Reflow Workshop
Technical Library | 2021-04-21 15:10:16.0
Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness. Due to the various advantages they offer, the use of Ball Grid Array packages is common across all industry sectors. They are also prone to process voiding issues. This study was performed to determine if vacuum assisted reflow process can help alleviate the voids in area array solder joints. Test parameters in this study largely focused on vacuum pressure level and vacuum dwell time.
Technical Library | 2022-10-31 18:35:40.0
Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness. Due to the various advantages they offer, the use of Ball Grid Array packages is common across all industry sectors. They are also prone to process voiding issues. This study was performed to determine if vacuum assisted reflow process can help alleviate the voids in area array solder joints. Test parameters in this study largely focused on vacuum pressure level and vacuum dwell time.
Technical Library | 2021-04-21 19:28:30.0
Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness.
Inclusions/voids will be reduced up to 99% Vacuum process can be switched on or off Nitrogen and air soldering possible Double sided PCB possible Pass through height: 30 mm (top and bottom) Small PCB with carrier Setting parameter: Time until sub-pre
