Industry News | 2009-05-26 18:45:31.0
TORRANCE, CA � May 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will exhibit the Sawa SC-500GE portable cleaner, as well as product literature for all Seika products at the upcoming SMTA Upper Midwest Expo & Tech Forum, scheduled to take place Thursday, June 11, 2009 at the Sheraton Bloomington Hotel in Bloomington, MN.
New Equipment | Solder Paste Stencils
Stentech produces mini stencils; small stencils that are used mainly for BGA re-work. Mini stencils are designed to deposit precise amounts of solder paste for single BGA footprints on loaded PCBs. These precision stencils mimic the footprint and ape
New Equipment | Rework & Repair Equipment
This unique rework stenciling system is very simple to use. Adhesive Backed Stencil Thickness: 004in (.10mm), .005in (.13mm) and .006in (.15mm) Minimum Aperture Size: .002in (.05mm) Stencil Material: Plastic film with release liner. The adhesive bac
InspectScan VPI is a fully integrated, stand-alone process control, measurement and inspection and programming workstation for use in setting up processes before the production floor in the PCB or Hybrid Microcircuit assembly industries. InspectScan
Industry News | 2016-02-25 12:54:53.0
FCT Assembly (www.fctassembly.com), well-known in the electronics assembly industry for its Fine Line Stencil and FCT Solder divisions, will highlight its broad portfolio of printing products at IPC APEX 2016 (www.ipcapexexpo.org), as well as take part in multiple technical conference programs. From booth # 1139 over March 15 - 17, the FCT exhibit will play host to the company’s various technologies including innovative step/relief stencil capabilities, NanoSlic Gold coated stencil and newly formulated, pre-released water soluble paste, WS890.
Industry News | 2016-03-18 11:10:25.0
KYZEN announces that it has been awarded a 2016 NPI Award in the category of Cleaning Materials for its AQUANOX® A8820 Advanced Aqueous Stencil Cleaner. The award was presented to the company during a Tuesday, March 15, 2016 ceremony that took place at the Las Vegas Convention Center during the IPC APEX EXPO. This marks KYZEN’s ninth consecutive NPI Award.
Industry News | 2016-04-30 12:56:29.0
KYZEN announces that it has been awarded the 2016 SMT China Vision Award in the category of Cleaning Materials for its AQUANOX® A8820 Advanced Aqueous Stencil Cleaner. The award was presented to the company on April 26, 2016 at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.
Industry News | 2016-05-05 20:48:30.0
KYZEN announces that it has been awarded the 2016 EM Asia Innovation Award in the category of Cleaning Materials for its AQUANOX® A8820 Advanced Aqueous Stencil Cleaner. The award was presented to the company on April 26, 2016 at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Technical Library | 2024-04-08 15:46:36.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
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