Electronics Forum | Fri Aug 08 11:44:44 EDT 2003 | Henry
I am fairly new to wave soldering and production processes, but I have been tasked with coming up with a calculation involving the shear strength of some through-hole leads. The leads are tinned copper and I suspect that tinning reduces the shear st
Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3
To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads
Electronics Forum | Mon Jun 22 21:31:43 EDT 1998 | Dave F
| Dear collegues, | I like to have your comments/ experience with various methods of depanelization like routing, scoring, cutting etc. | Any feed back on the equipment used with company addresses will be highly appreciated. | Please identify if pos
Electronics Forum | Tue Jul 14 07:12:53 EDT 1998 | smd
I asked the same question a couple of weeks ago. I received a lot of e-mail from salesmen et al trying to sell me equipment costing several thousand dollars. I was glad to get all the information I could, but there was no way I was going to get a PO
Electronics Forum | Mon Oct 04 07:48:34 EDT 2010 | scottp
When you break them where is the failure? Is it the solder joint (doubtful), the part termination, the body of the part, or the board? If in the solder joint, is it in the bulk solder or intermetallic? If in the part, what direction is the crack?
Electronics Forum | Wed Sep 29 09:35:39 EDT 2010 | blnorman
Can any body help me that how can I check the > strength of the 0603 capacitor & how much it > should be? Is there any standard for the > soldering strength of the Diffrent SMT > packages. Manjeet singh I'm not aware of a standard that provides
Electronics Forum | Fri Jan 15 09:27:18 EST 1999 | Earl Moon
| I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | Thank you, | Wirat
Electronics Forum | Tue Oct 05 08:01:57 EDT 2010 | scottp
Have you confirmed in an SEM that the break is in the solder and not in the termination? If not in the termination, is it in the intermetallic rather than the bulk solder? It's unusual for the break to be in the solder joint when chips are knocked
Electronics Forum | Mon Jul 29 09:27:15 EDT 2013 | charliedci
All of our reflow is with room air, 63/37 and SAC305. I believe nitrogen will get you better looking solder joints (shiny, less grainy under magnification), but per IPC, functionality and strength I don't think there is much difference.
