Industry News | 2023-11-06 12:15:18.0
Nihon Superior Co. Ltd. are delighted to announce the renewal of their longstanding partnership. In a testament to their shared success, Nihon Superior has granted FCT Solder a license for its innovative SN100CV solder alloy, reaffirming their commitment to collaboration. With this renewed partnership, FCT Solder has earned the distinction of being the first and exclusive licensee of Nihon Superior's SN100CV alloy in North America.
Industry News | 2024-05-20 11:05:28.0
Indium Corporation Technical Support Engineer, CSMPTE, Thuy Nguyen will present at the SMTA Rocky Mountain Expo on May 16 in Aurora, Colorado. The presentation, Exploring Alternative Solder Alloys and Their Beneficial Attributes, will examine alternative alloys with enhanced reliability performance.
Industry News | 2024-06-10 10:22:35.0
SHENMAO Technology proudly announces the development of its new thermal fatigue-resistant solder paste, PF918-P250. Designed to meet high-reliability requirements, PF918-P250 offers advanced features and superior performance for electronic products requiring exceptional durability.
Technical Library | 2018-05-17 11:14:52.0
Intermetallic compound (IMC) growth is being studied in earnest in this past decade because of its significant effect the solder joint reliability. It appears that from numerous investigations conducted, excessive growth of IMC could lead to solder joint failure. Leading to this, many attempts has been made to determine the actual IMC thickness. However, precise and true representation of the growth in the actual 3D phenomenon from 2D cross-section investigations has remained unclear. This paper will focus on the measuring the IMC thickness using 3D surface profilometer (Alicona Focus G4). Lead free solder, Sn3.0Ag0.5Cu (SAC305) was soldered onto copper printed circuit board (Cu PCB). The samples were then subjected to thermal cycle (TC) storage process with temperature range from 0 °C to 100 °C for 200 cycles and up to 1000 cycles were completed.
Technical Library | 2020-10-27 02:02:17.0
Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. The question commonly asked is "when should we switch from Type 3 to a smaller solder powder?" Solder powder size is usually chosen based on the printing requirements for the solder paste. It is common practice to use IPC Type 4 or 5 solder powders for stencil designs that include area ratios below the recommended IPC limit of 0.66. The effects of solder powder size on printability of solder paste have been well documented. The size of the solder powder affects the performance of the solder paste in other ways. Shelf life, stencil life, reflow performance, voiding behavior, and reactivity / stability are all affected by solder powder size. Testing was conducted to measure each of these solder paste performance attributes for IPC Type 3, Type 4, Type 5 and Type 6 SAC305 solder powders in both water soluble and no clean solder pastes. The performance data for each size of solder powder in each solder paste flux was quantified and summarized. Guidance for choosing the optimal size of solder powder is given based on the results of this study.
Technical Library | 2022-12-05 16:28:06.0
The work evaluates the impact of latent heat (LH) absorbed or released by a solder alloy during melting or solidification, respectively, on changes of dimensions of materials surrounding of the solder alloy. Our sample comprises a small printed circuit board (PCB) with a blind via filled with lead-free alloy SAC305. Differential scanning calorimetry (DSC) was employed to obtain the amount of LH per mass and a thermomechanical analyzer was used to measure the thermally induced deformation. A plateau during melting and a peak during solidification were detected during the course of dimension change. The peak height reached 1.6 μm in the place of the heat source and 0.3 μm in the distance of 3 mm from the source. The data measured during solidification was compared to a numerical model based on the finite element method. An excellent quantitative agreement was observed which confirms that the transient expansion of PCB during cooling can be explained by the release of LH from the solder alloy during solidification. Our results have important implications for the design of PCB assemblies where the contribution of recalescence to thermal stress can lead to solder joint failure.
New Equipment | Solder Materials
DKL Metals offer a range of flux cored solder wires in a variety of alloy specifications including SN100C (SnCuNi), E-Qual 97TSC (SAC305), E-Qual 96TSC (SAC387), Alloy 23 (SnCu) and Alloy 28 (SnAg). A selection of our more popular products are detail
Industry News | 2009-11-11 12:21:33.0
OSAKA, JAPAN — November 2009 — Nihon Superior Co. Ltd. announces that it has been awarded a 2009 Global Technology Award in the category of Soldering Materials for its SN100C P600 D4 Solder Paste. The award was presented to the company during a Tuesday, November 10, 2009 ceremony that took place at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2012-03-28 15:59:44.0
Nihon Superior Shanghai Co. Ltd., a subsidiary of Nihon Superior Co. Ltd. will showcase a new and expanded range of products based on its SN100C® silver-free, lead-free solder at the upcoming NEPCON China 2012 exhibition in Shanghai.
Industry News | 2008-10-07 18:25:16.0
GREELEY, CO � October 2008 � FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.'s SN100C product line, announces that it has recently seen an increase in sales of NC162 flux.
