Technical Library | 2018-10-03 20:41:44.0
Voids in solder joints plague many electronics manufacturers. Do you have voids in your life? We have good news for you, there are many excellent ways to "Fill the Void." This paper is a continuation of previous work on voiding in which the following variables were studied: water soluble lead-free solder pastes, a variety of stencil designs, and reflow profiles. Quad Flat No-Lead (QFN) component thermal pads were used as the test vehicle. The voiding results were summarized and recommendations were made for reduction of voiding.
Industry News | 2022-03-14 08:01:52.0
Kurtz Ersa Inc. is pleased to announce that it has released the new EXOS 10/26 convection reflow soldering system with a vacuum chamber of 600 mm to handle PCBs with a maximum length of 600 mm.
Industry News | 2020-10-03 08:37:30.0
Kurtz Ersa Inc. received a 2020 GLOBAL Technology Award in the category of Best Product – Europe for its EXOS 10/26 convection reflow soldering system. The award was announced during a Virtual Awards Ceremony on Tuesday, Sept. 29, 2020.
Industry News | 2020-10-04 15:52:14.0
Kurtz Ersa Inc. received a 2020 GLOBAL Technology Award in the category of Best Product – Europe for its EXOS 10/26 convection reflow soldering system. The award was announced during a Virtual Awards Ceremony on Tuesday, Sept. 29, 2020.
Industry News | 2021-07-27 15:49:00.0
BTU International, Inc. today announced plans to exhibit at NEPCON South China, scheduled to take place Aug. 25-27, 2021 at the Shenzhen International Convention & Exhibition Center, booth number 1P45. BTU will showcase the new Valence 3508 selective soldering system and PYRAMAX™ Vacuum Reflow Oven.
Industry News | 2016-02-15 20:36:38.0
Kurtz Ersa North America will exhibit in Booth #1326 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Ersa will introduce its new line of selective solder, reflow and rework equipment and more.
Industry News | 2023-05-03 08:42:08.0
To support its growing customer base leading CEM, Custom Interconnect Ltd. (CIL), required innovative equipment that could meet the exacting specifications required to produce complex and critical applications. Through Altus, CIL has the best-in-class equipment, including vapour phase soldering systems and component counter technology to manufacture highly complex PCBAs.
Industry News | 2021-07-27 15:48:50.0
BTU International, Inc. today announced plans to exhibit at NEPCON South China, scheduled to take place Aug. 25-27, 2021 at the Shenzhen International Convention & Exhibition Center, booth number 1P45. BTU will showcase the new Valence 3508 selective soldering system and PYRAMAX™ Vacuum Reflow Oven.
Industry News | 2010-04-23 21:21:38.0
Never content to rest on the laurels of its proven lead-free success, Henkel has developed and launched Multicore LF620: a new lead-free solder paste that effectively delivers on a broad range of demanding requirements, essentially offering a lead-free paste that has it all.
Technical Library | 2018-09-26 20:33:26.0
Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and – most notably – center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.
A global industrial auction and valuation business with extensive experience in SMT, PCB Assembly & Manufacturing, Test, Semiconductor and other Electronics Machinery & Equipment.
Manufacturer / Equipment Dealer / Broker / Auctions
896 Main Street
Branford, CT USA
Phone: 203-488-7020
