Full Site - : reduce the void with vacuum reflow (Page 5 of 16)

Altus Achieves Record Installations in the UK with Heller's Innovative MK7 Convection Reflow System

Industry News | 2023-06-26 09:23:08.0

Altus Group has revealed that since partnering with Heller Industries, they have seen unprecedented installations throughout the UK particularly following the launch of the new MK7 convection reflow system thanks to its ground-breaking design and features.

Altus Group

BTU International Redefines Operational Value and Efficiency with the Aurora Platform of Reflow Ovens

Industry News | 2024-03-26 13:05:01.0

BTU International, Inc. is proud to announce that its new Aurora platform of reflow ovens is designed to minimize the Cost of Ownership (CoO) while maximizing performance and operational value for its users. With a focus on precision, consistency, and efficiency, the Aurora platform sets a new standard for thermal processing in electronics manufacturing.

BTU International

Viscom to Exhibit 3-D SPI Unit with SPI-AOI Uplink at the IPC APEX Expo

Industry News | 2012-01-19 23:09:10.0

Viscom proudly announces that it will exhibit its recently introduced 3-D SPI system in Booth #2629 at the upcoming IPC APEX Expo. The system is now available with the unique SPI-AOI Uplink feature that provides better defect detection during post-reflow AOI, ensuring the lowest false alarm rates.

Viscom AG

PACE Offers 10 Free Nozzles with the Purchase of New TF 1800 BGA Rework System

Industry News | 2016-10-26 14:55:50.0

Vass, NC – Sept 20, 2016 – PACE Worldwide announces an introductory promotion in conjunction with the launch of their new TF 1800 BGA/SMD Rework System, which began shipping in October. For a limited time, PACE will provide 10 Heat Focusing Nozzles free of charge with the purchase of each TF 1800 System, a value of over $3,400 (£2,700/€3,340).

PACE Worldwide

BTU to Show the PYRAMAX™ with ENERGY PILOT Software at SMT Hybrid Packaging

Industry News | 2015-04-06 16:37:35.0

BTU International will exhibit in Booth #7-421 at SMT Hybrid Packaging, scheduled to take place May 5-7, 2015, in Nuremberg, Germany. Company representatives will highlight the proven PYRAMAX™ and the award winning DYNAMO™ convection reflow ovens, both equipped with the new ENERGY PILOT software, designed to reduce the consumption of electrical power and process gas.

BTU International

MacDermid Alpha Electronics Solutions to Participate at the Soldering Forum 2021 in Partnership with smartTec GmbH

Industry News | 2021-09-30 14:55:33.0

The Assembly Division of MacDermid Alpha Electronics Solutions will participate at the upcoming Soldering Forum 2021 hosted by its ALPHA product distributor for Germany, Austria, and Nordic, smartTec GmbH from October 5th-7th in Rodgau, Germany.

MacDermid Alpha Electronics Solutions

See the Invisible World with Pemtron Inspection equipment at SMTconnect 2023

Industry News | 2023-04-11 09:58:09.0

Pemtron Europe scheduled to take place May 9-11, 2023 in Nuremberg, Germany. See the invisible world in Hall 4, Stand 331 – Pemtron develops the best inspection equipment with the world's best technology. Systems on display include the Saturn 3D Inline Solder Paste Inspection System, Athena 3D Automated Optical Inspection System, TWIN 3D Automated Optical Inspection System and TROI 8800 CI Series Conformal Coating Inspection System.

Pemtron

Move up the SMART FACTORY Learning Curve with KIC at SMTA International

Industry News | 2017-08-15 21:08:19.0

KIC announces plans to exhibit in Booth #123 at SMTA International, scheduled to take place September 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. The KIC team will showcase the KIC ecosystem comprised of the brand new SPS Smart Profiler, RPI automatic profiling system, and the new Vantage with networked real-time dashboard.

KIC Thermal

Attendees Will Learn How to Maximize Process Traceability with the KIC RPI at SMT Nuremberg

Industry News | 2015-04-27 17:15:21.0

KIC today announced that it will exhibit in Hall 7a – Booth 321 at SMT Hybrid Packaging, scheduled to take place May 5-7, 2015 in Nuremberg, Germany. The KIC RPI brings process and deficiency information to the thermal process that was previously limited to screen printing and pick-and-place machines.

KIC Thermal


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