Industry News | 2010-09-29 23:32:58.0
Christopher Associates/Koki Solder announce that Jasbir Bath will present a paper titled “An Investigation into the Development of Tin-Lead and Lead-Free Solder Pastes to Reduce Voiding in Large Contact Area Power Transistor/QFN Type Components” at the upcoming SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2012-09-12 17:00:31.0
Nihon Superior Co. Ltdwill introduce newly developed solder paste for low voiding in soldering processes and materials
Industry News | 2021-02-23 15:00:48.0
BTU International, Inc. today announced plans to exhibit at SEMICON China, scheduled to take place March 17-19, 2021 at the Shanghai New International Expo Centre. The PYRAMAX™ Vacuum Reflow Oven will be displayed in the CohPros booth, Hall E7 #7343.
Industry News | 2018-01-24 21:25:37.0
BTU International will exhibit in Booth #927 at the 2018 IPC APEX EXPO, scheduled to take place February 27 - March 1, 2018 at the San Diego Convention Center in CA. The company plans to exhibit its new PYRAMAX™ Vacuum reflow oven.
Industry News | 2017-10-17 19:15:13.0
BTU International today announced plans to introduce its new PYRAMAX™ Vacuum reflow oven. The system will be on display for the first time in Hall A3, Stand 154 at productronica 2017, scheduled to take place Nov. 14 – 17, 2017 at the Messe München in Germany with EPP Electronic Production Partners GmbH.
Inclusions/voids will be reduced up to 99% Vacuum process can be switched on or off Nitrogen and air soldering possible Double sided PCB possible Pass through height: 30 mm (top and bottom) Small PCB with carrier Setting parameter: Time until sub-pre
Industry News | 2012-07-10 11:27:53.0
Nihon Superior (Singapore) Pte. Ltd.,announces that it will showcase a new, expanded range of products in booth G2 at the upcoming IPCA INTERNATIONAL EXPO 2012, scheduled to take place July 25-27, 2012 in KTPO TRADE CENTRE, WHITEFIELD, in BANGALORE, INDIA.
Used SMT Equipment | Soldering - Reflow
Newly-designed low-height lid is adopted on Heller 1936 MK7, simplifying the operation and maintenance, reducing the temperature of the surface, and saving energy. The vertical curing oven developed by Heller is available to replace the traditional
Industry News | 2022-05-05 17:38:12.0
The Assembly Division of MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing will discuss solutions for voiding at the SMTA Juarez Expo & Tech Forum on Thursday, May 19.
Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 lead-free soldering paste SMT Solder Paste Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 flux solder paste Product description: Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 is a no-clean, lead-free,
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