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Industry News | 2018-12-08 03:27:35.0
Printed Circuit Board (PCB) for Surface Mount Technology (SMT)
Industry News | 2018-10-11 19:33:26.0
Anda Technologies USA announces that its Board Handling Conveyors are ideal for a range of PCB handling applications and can optimize Work-In-Progress (WIP) material flow during assembly, coating, dispensing and other processes.
Industry News | 2013-12-12 14:39:45.0
Express Manufacturing, Inc. (EMI) announces the implementation of a plan to expand support for their current and future customers from 2014. Developed as a response to customer feedback, this plan will address customer demand for high quality products with smaller packages and a shorter time-to-market.
Industry News | 2021-09-24 13:31:07.0
Investments over the past 18 months support continuing technology advancements and business growth at the electronics design and contract manufacturing center near Rochester, NY
Technical Library | 2021-08-04 18:46:25.0
The process of printed circuit board assembly (PCBA) involves several machines, such as a stencil printer, placement machine and reflow oven, to solder and assemble electronic components onto printed circuit boards (PCBs). In the production flow, some failure prevention mechanisms are deployed to ensure the designated quality of PCBA, including solder paste inspection (SPI), automated optical inspection (AOI) and in-circuit testing (ICT). However, such methods to locate the failures are reactive in nature, which may create waste and require additional effort to be spent re-manufacturing and inspecting the PCBs. Worse still, the process performance of the assembly process cannot be guaranteed at a high level. Therefore, there is a need to improve the performance of the PCBA process. To address the aforementioned challenges in the PCBA process, an intelligent assembly process improvement system (IAPIS) is proposed, which integrates the k-means clustering method and multi-response Taguchi method to formulate a pro-active approach to investigate and manage the process performance.
Electronics Forum | Wed Feb 02 13:05:51 EST 2005 | russ
Process flow 1.Remove part - It may be necessary to bake assembly prior to removing. 2.Remove remaining solder from part 3.Apply flux to part 4.Apply solder spheres to part 5.Reflow part You may want to bake component before re-installing 6.Apply
Electronics Forum | Wed Mar 02 13:15:16 EST 2022 | chris007
I am currently working on a manufacturing flow where some PCBA are processed with reflow oven (after being baked before processing), then cleaned with bath, then passed into contaminometer, passed into AOI. The point is after all of this, if AOI dete
