Industry News | 2015-08-25 10:57:24.0
KYZEN announces that it will exhibit in Booth #117 at SMTA International, scheduled to take place September 29-30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. The KYZEN team will showcase its AQUANOX® A4708 pH Neutral Electronic Assembly Cleaning Chemistry and celebrate its 25-year anniversary.
Industry News | 2010-06-11 15:16:36.0
MADISON, AL — STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that Mark McMeen, VP of Engineering Services, will present “Imbedded Component/Die Technology (IC/DT®)” at the upcoming SMTA Tampa Chapter Industry Expo. The presentation is scheduled to take place Wednesday, June, 16, 2010 at 5 p.m. at the Mirage at Tucson’s in Clearwater, FL.
Industry News | 2024-01-29 11:14:41.0
Indium Corporation Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will present at iNEMI's upcoming seminar, Humidity Robustness and Isolation Coordination for e-Mobility. The seminar, hosted by ZESTRON Europe, will be held on February 1 in Ingolstadt, Germany.
Industry News | 2011-08-29 17:01:41.0
Kyzen announces that Dr. Mike Bixenman will present “Design for Cleaning Medical Electronic Circuit Devices” at the 2011 Medical Electronics Symposium presented by MEPTEC and SMTA.
Industry News | 2013-03-26 08:49:47.0
OK International will demonstrate the new Metcal MX-5200 Soldering, Desoldering and Rework Series in booth 1E41 NEPCON China 2013, scheduled to take place April 23-25, 2013 at the Shanghai World EXPO Exhibition & Convention Center.
Industry News | 2013-11-14 18:21:25.0
Indium Corporation's Sze Pei Lim, Technical Manager - Asia-Pacific Operations, and Sehar Samiappan, Area Technical Manager, will present at the IPC Conference on Assembly and Reliability November 20 in Bangkok, Thailand.
Industry News | 2018-10-15 18:31:07.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
Industry News | 2018-10-18 19:55:33.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
Industry News | 2013-08-15 11:59:29.0
OK International will demonstrate the new Metcal MX-5200 and Scorpion with Side-View Camera in Stand A-1K25 at NEPCON South China 2013, scheduled to take place August 27-29, 2013 at the Shenzhen Convention & Exhibition Center in China.
Industry News | 2013-04-10 11:48:47.0
Essemtec, announces that it will exhibit numerous flexible Swiss-made solutions in Booth 7, Hall 211 at the SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
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