Industry News | 2008-09-08 18:17:57.0
Essemtec's new stencil printer SP003-ML-V is a highly reliable system aimed at small and medium production volumes. Control of print quality and correction of print position is made easy and fast using the integrated vision system.
Industry News | 2007-11-12 20:08:47.0
ITASCA, IL � November 12, 2007 � Kester announces that it has entered into an agreement with Speedline Technologies during the Productronica 2007 exhibition and conference, scheduled to take place November 13-16, 2007 at the Munich Trade Fair Center in Munich, Germany.
Industry News | 2011-01-10 13:38:22.0
IBL Technologies LLC, a division of IBL Löttechnik GmbH, announces that Lockheed Martin has purchased an IBL BLC-609 vapor phrase system.
New Equipment | Solder Materials
http://www.flason-smt.com/product/100g-Solder-Paste-for-BGA-refwork-mobile-phone-repare.html 100g Solder Paste for BGA refwork mobile phone repare 100g Solder Paste BGA refwork Solder Paste mobile phone repare Solder Paste 100g Solder Paste fo
Technical Library | 2023-09-26 19:14:44.0
The transition from tin-lead to lead free soldering in the electronics manufacturing industry has been in progress for the past 10 years. In the interim period before lead free assemblies are uniformly accepted, mixed formulation solder joints are becoming commonplace in electronic assemblies. For example, area array components (BGA/CSP) are frequently available only with lead free Sn-Ag-Cu (SAC) solder balls. Such parts are often assembled to printed circuit boards using traditional 63Sn-37Pb solder paste. The resulting solder joints contain unusual quaternary alloys of Sn, Ag, Cu, and Pb. In addition, the alloy composition can vary across the solder joint based on the paste to ball solder volumes and the reflow profile utilized. The mechanical and physical properties of such Sn-Ag-Cu-Pb alloys have not been explored extensively in the literature. In addition, the reliability of mixed formulation solder joints is poorly understood.
Industry News | 2013-01-16 08:45:06.0
Nihon Superior Co. Ltdwill introduce a range newly developed products that offer solutions for some of the challenges the electronics industry is now facing, lead-free die attach, void minimization, environmental protection, and process yields.
Industry News | 2019-06-11 10:33:49.0
KYZEN announced plans to exhibit at SEMICON West, scheduled to take place July 9-11, 2019 at the Moscone Center in San Francisco, CA. The KYZEN team will offer free cleaning assessments and an inside look at their chemistries, MICRONOX® M2322 and MICRONOX® M2708, in Booth #5369.
New Equipment | Rework & Repair Equipment
Ultimate Performance, BGA Rework Station for small-large PCBs up to 24"/620mm The PDR E6 XL BGA Rework Station is made of only the finest materials and components for optimum precision and rework excellence. PDR's E6 SMD Rework Station is PDR's larg
Industry News | 2010-01-19 13:47:38.0
January 2010 — The Balver Zinn Group announces that Cobar Europe BV will exhibit a complete range of advanced soldering materials from bar solder to SMT solder paste to high-performance fluxes at the upcoming Pan Pacific Microelectronics Symposium & Tabletop Exhibition, scheduled to take place January 26-28, 2010 at the Sheraton Kauai Resort, on Kauai, Hawaii.
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
