Full Site - : matte tin mitigation (Page 1 of 21)

Tin Whiskers: Mitigation with Conformal Coatings | Part II

Technical Library | 2019-06-20 07:45:19.0

One of the two basic risks of employing the commercially accepted, Restriction of Hazardous Substances (RoHS) compliant, lead-free (Pb-free) electronics is the threat to the electronics reliability from the growth of tin whiskers. The other basic risk deals with Pb-free solder joint reliability.

ACI Technologies, Inc.

Lead-Free Risk Mitigation -- A Case Study

Technical Library | 2020-07-01 19:45:04.0

A company approached ACI Technologies (ACI) for assistance with a new product that was about to undergo its initial proof-of-concept prototype build. This product was an item that was being furnished to the Department of Defense for a program designed to increase the technical capabilities of computer equipment issued to the war fighter. The requirements for this item specified the use of tin-lead solder during assembly of production units. One of the main responsibilities for ACI during this project was to assist the client in mitigating the risk introduced using commercial off-the-shelf materials that may be lead-free.

ACI Technologies, Inc.

Advanced Electronics Manufacturing Processes Boot Camp (Boot Camp B)

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

ACI Technologies, Inc.

IPC and CALCE Present 7th International Symposium on Tin Whiskers Event to Feature Experts from CALCE, Lockheed Martin and Other Leading Organizations

Industry News | 2013-10-01 18:21:25.0

IPC — Association Connecting Electronics Industries® and its educational partner, CALCE® (Center for Advanced Life Cycle Engineering) at the University of Maryland, will host the 7th International Symposium on Tin Whiskers, November 12–13, 2013, in Costa Mesa, Calif.

Association Connecting Electronics Industries (IPC)

SMTA Announces Co-Located June Events in Denmark

Industry News | 2009-02-24 13:53:56.0

Minneapolis, MN � The SMTA is pleased to announce its industry premier in Denmark with two co-located events focusing respectively on Tin Whiskers and Counterfeit Electronic Parts issues. The events will be held from June 23-26, 2009 at the Technical University of Denmark in Lyngby.

Surface Mount Technology Association (SMTA)

Call for Participation - Get More Bang for Your Buck with Two Presentation Opportunities in Denmark

Industry News | 2009-03-02 00:48:35.0

The SMTA and CALCE/University of Maryland are pleased to announce their industry premier in Denmark with two co-located events focusing respectively on Tin Whiskers and Counterfeit Electronic Parts issues. The events will be held June 23-26, 2009 at the Technical University of Denmark in Lyngby and are supported by the Centre for Electronic Corrosion (CELCORR) and ATV-SEMAPP at the Technical University of Denmark.

Surface Mount Technology Association (SMTA)

Is Stress the Root of Tin Whisker Growth? Brown University professor and other experts to present research at 7th International Tin Whiskers Symposium

Industry News | 2013-11-01 16:09:44.0

Eric Chason, Ph.D., professor of engineering at Brown University, will present his tin whisker research at the 7th International Tin Whiskers Symposium, November 12–13 in Costa Mesa, Calif., hosted by IPC with academic partner CALCE.

Association Connecting Electronics Industries (IPC)

IPC & SMTA High-Reliability Cleaning & Conformal Coating Conference to Present “Research Methods for Mitigating Field Failures” Session

Industry News | 2014-10-12 19:48:10.0

Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, IL.

Association Connecting Electronics Industries (IPC)

IPC and CALCE Seek Technical Papers for Tin Whiskers Symposium

Industry News | 2013-05-15 11:48:55.0

IPC – Association Connecting Electronics Industries® and the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland have issued a call for papers for the 7th International Symposium on Tin Whiskers.

Association Connecting Electronics Industries (IPC)

Newly Updated IPC-AJ-820A Provides Nitty-Gritty of Electronics Assembly and Soldering

Industry News | 2012-03-21 17:42:19.0

For many designers and manufacturing personnel in the electronics manufacturing supply chain, IPC-AJ-820, Assembly and Joining Handbook, is the document of choice for all aspects involved in creating a PCB.

Association Connecting Electronics Industries (IPC)


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