Electronics Forum | Mon Aug 23 11:27:00 EDT 1999 | Dave F
0.6 �m (25 micro inches) and self-limit around 5 mils depending on the material being plated and the process. Similarly with white tin, laminates with cleaned copper are immersed in a series of tin baths without an external source of electric curren
Electronics Forum | Tue Jul 18 20:10:09 EDT 2000 | Dave F
Hey Bud: Thanks for the response the other day. We currently use "Jeff�s Method #2: The Drummel Tool." Short answer to your brother is ... yes, probably. Expanding a bit: � It would be surprising not to use a flux to help reflow the solder balls
Electronics Forum | Tue Aug 31 20:51:20 EDT 1999 | Raeto Zryd
Dear fellow process engineers, Some solder joints "trough hole component" have cracked. I suspect that in the market some technician tryed to straighten some components (LED) and has applied enough force to actually brake the joint. The joints were
Electronics Forum | Wed Sep 01 13:48:29 EDT 1999 | Dave F
| Dear fellow process engineers, | | Some solder joints "trough hole component" have cracked. I suspect that in the market some technician tryed to straighten some components (LED) and has applied enough force to actually brake the joint. The joints
Electronics Forum | Thu Jun 29 10:38:04 EDT 2000 | John Thorup
Hello Christopher I don't know if there is any kind of official standard but I can tell you that the HADCO DFM manual specifies a nominal thickness of 50-1500u" with an option for 100-1000u" and the Merix DFM manual specifies 30-200u" Our boards (fro
Electronics Forum | Fri Jan 22 14:24:44 EST 1999 | Dave F
| I was just wondering what solutions are out there for dry storage. Our basic need is to be able to store boards that have been baked and need to remain moisture free for up to a week. | Michael: Let's take a different angle on this. Why not ha
Electronics Forum | Fri Jan 22 17:38:07 EST 1999 | Michael Larsen
| | I was just wondering what solutions are out there for dry storage. Our basic need is to be able to store boards that have been baked and need to remain moisture free for up to a week. | | | Michael: Let's take a different angle on this. Why
Electronics Forum | Fri Oct 30 15:09:44 EST 1998 | ChungPark
| Dear all, | | What are your views on reworking BGA's? I mean, with the BGA going through reflow temperatures four times or more, and with a manual reballing process, wouldn't it raise up a few reliability issues? Would you consider not doing rew
Electronics Forum | Wed Feb 18 12:08:04 EST 1998 | Eyal Epstein
Hi, I am from Celtronix Ltd. we are a provider of Odd Form assembly equipment and have gained a lot of experience in double side reflow, both the chemical side of it as well as the automatic insertion of all types of TH components in paste. Enclosed
Electronics Forum | Fri Feb 11 08:15:35 EST 2005 | davef
It sounds like you already know the answer. Hand soldering is much more stressful to a board than mass soldering, because: * It is more localized and there is no preheat. * It is more difficult to control. [Different connections require different h
