Events Calendar | Thu May 17 00:00:00 EDT 2018 - Fri May 18 00:00:00 EDT 2018 | ,
Tin Whisker - All You Should Know - SMTA Webtorial
Technical Library | 2019-06-19 11:06:46.0
Tin (Sn) metal displays the characteristic of growing “tin whiskers” from pure tin coatings (most actively on relatively thin, electrodeposited or immersion tin coatings), usually months or years from the initial deposition of the tin. Tin whiskers are electrically conductive, filamentary, single crystals of white (beta phase) tin. These filaments of single crystal tin are usually one to five microns in diameter, and a few microns up to several tens of millimeters long, that grow spontaneously from the tin coatings. Alloying additions of several percent (by weight) of lead (Pb) prevents these electrically conductive tin whiskers from growing. Pb alloyed into the Sn was discovered to prevent the occurrence of tin whiskers in electronic assemblies in the 1950s as the Bell Laboratories solution to the problem of tin whiskers. The alloying of the tin with lead has thus quietly averted incalculable losses from short circuits in electronic equipment for the last 60 years.
Technical Library | 2019-06-20 07:45:19.0
One of the two basic risks of employing the commercially accepted, Restriction of Hazardous Substances (RoHS) compliant, lead-free (Pb-free) electronics is the threat to the electronics reliability from the growth of tin whiskers. The other basic risk deals with Pb-free solder joint reliability.
Industry News | 2013-11-01 16:09:44.0
Eric Chason, Ph.D., professor of engineering at Brown University, will present his tin whisker research at the 7th International Tin Whiskers Symposium, November 12–13 in Costa Mesa, Calif., hosted by IPC with academic partner CALCE.
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Industry News | 2013-10-01 18:21:25.0
IPC — Association Connecting Electronics Industries® and its educational partner, CALCE® (Center for Advanced Life Cycle Engineering) at the University of Maryland, will host the 7th International Symposium on Tin Whiskers, November 12–13, 2013, in Costa Mesa, Calif.
Industry News | 2009-02-24 13:53:56.0
Minneapolis, MN � The SMTA is pleased to announce its industry premier in Denmark with two co-located events focusing respectively on Tin Whiskers and Counterfeit Electronic Parts issues. The events will be held from June 23-26, 2009 at the Technical University of Denmark in Lyngby.
Industry News | 2009-03-02 00:48:35.0
The SMTA and CALCE/University of Maryland are pleased to announce their industry premier in Denmark with two co-located events focusing respectively on Tin Whiskers and Counterfeit Electronic Parts issues. The events will be held June 23-26, 2009 at the Technical University of Denmark in Lyngby and are supported by the Centre for Electronic Corrosion (CELCORR) and ATV-SEMAPP at the Technical University of Denmark.
Industry News | 2013-05-15 11:48:55.0
IPC – Association Connecting Electronics Industries® and the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland have issued a call for papers for the 7th International Symposium on Tin Whiskers.
Industry News | 2011-07-18 12:24:54.0
The Capital Chapter is pleased to announce the second technical presentation for their Expo and Tech Forum which will be held at the Johns Hopkins University, in Laurel MD on September 13, 2011.
