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New Equipment | Industrial Automation
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Industry News | 2014-08-07 11:41:44.0
Indium Corporation's Sze Pei Lim, technical manager - Southeast Asia; and Sehar Samiappan, area technical manager, will present at the IPC Southeast Asia High Reliability Conference on August 20 in Penang, Malaysia.
Industry News | 2013-03-04 12:11:10.0
Developed alongside and accepted by the automotive industry, Henkel Electronic Materials announces the commercial availability of 90iSC, a high-reliability, lead-free solder alloy for demanding high-temperature applications. The new alloy, which addresses the drawbacks certain products experience with traditional SAC alloys, has been proven as a viable lead-free solution for applications where extremely high reliability is required.
Industry News | 2013-06-03 11:00:12.0
The smaller the circuit board, the less space there is to connect the individual components. Wire bonding provides a very reliable alternative to soldered connections, and it is with this approved method that Würth Elektronik is expanding its service portfolio and taking a further step towards becoming a global circuit board systems company.
Industry News | 2003-02-14 08:03:50.0
Provides Devices with Excellent Protection Against EMI and Overcomes Limitations of Metal Cans
Industry News | 2022-01-29 13:23:58.0
Ventec International Group (6672 TT) is pleased to announce that its US facility in Fullerton (CA), is now certified according to AS9100 Revision D and ISO 9001:2015, the quality-management standard for the aviation, space, and defense industries.
Industry News | 2024-01-29 11:39:36.0
Two Indium Corporation experts are set to deliver technical presentations on low-temperature soldering at the upcoming Pan Pacific Strategic Electronics Symposium (Pan Pac), hosted by SMTA, January 29–February 1 in Hawaii.
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New Equipment | Industrial Automation
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New Equipment | Industrial Automation
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Electronics Forum | Mon May 14 17:12:20 EDT 2001 | davef
Continuing along the path that Brian took ... IPC-7525 gives design guideline for stepped stencils. It goes something like: * Stepped area SB GT 25 thou from pads located on the greatest thickness of the stencil * Pads in stepped area SB GT 35 tho
