New Equipment | Fabrication Services
Base Material: Aluminium Layer count: ten layer Board thickness: 3.0mm Copper Thickness:2 oz Surface finish: HASL Soldermask Colors: White
Parts & Supplies | Circuit Board Assembly Products
1). FR-4 Material 2). 2 layer, 1.2mm thick 3). 1 oz copper weight. 4). LPI Green solder mask/White silk screen 5). Gold finger 40 microinch, bevelled. 6). HASL + Gold finger, ENIG + gold finger 7). Larg volum, punch contour.
Please visit our main microsectional analysis page for more information. Process Sciences uses microsection for both failure analysis and process validation. Our cross sections reveal intermetallic layers, defects, and other physical characteristic
Industry Directory | Manufacturer
PCB maker in Penang. 2-14 layers PCB. HASL, ENIG, OSP. ImmAg. george.lim@elnapcb.com
Industry Directory | Manufacturer
PCB manufacturer. 2, 4, 6, 8 layers PCB. HASL, ENIG, OSP.
1). Size: 45*140mm/1 up 2). Layer count: 2 Layer, 20 μm PTH 3). Thickness: 1.6mm +/- 10% 4). Copper weight(Finished): 35 μm 5). SMOBC: LPI Green solder mask/ White legend 6). Holes: 0.4mm minimum, 4/4 mil track/space 7). Pads finish: HASL 8).
Parts & Supplies | Circuit Board Assembly Products
1). FR-4 Tg170, Lead-free, Low Z-axis CTE, Low water absorption. 2). Excellent thermal stability and anti-CAF performance 3). 2-30 layer, 1.6mm thick 4). 1 oz copper finished 5). 10% impedance control 6). Immersion gold, HASL LF. 7). Suitable for hig
New Equipment | Solder Materials
The trace addition of Ni means fewer shorts and no shrinkage defects Ni-stabilized intermetallic layer inhibits copper erosion Reliable in harsh environments High ductility ensure long service life of joints subjected to cyclic strain SN100C is f
Layer: 6 layers Material: FR-4 Board Thickness: 1.0mm Surface Finish:ENIG Copper Thickness: 1 oz all layers Blind via L1~L2 and L1~L3 Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width
Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ M
