Full Site - : hasl intermetallic (Page 6 of 8)

ENiG or IAg? Which is better?

Electronics Forum | Fri Mar 14 15:14:31 EDT 2008 | samir

Dean, thanks for schooling me on this. I talked to an industry collegue whom I met at APEX, and it was he who had told me of the IAg "rework issue." Basically, he told me that they had field failures on QFPs that were a direct result of trying to "

Eutectic Solder On A Lead Free HASL PCB

Electronics Forum | Thu Aug 20 15:10:21 EDT 2009 | davef

Responding to your points: * The intermettalic layers [ie, Cu6Sn5, Cu3Sn] between the solder and the copper pad is the same composition with both lead free and leaded solder. The lead in solder has no impact on the intermetallic. * As you say, increa

Sn100C Plating, Mixed Alloy Scenario

Electronics Forum | Tue Dec 13 15:18:32 EST 2011 | ck_the_flip

DaveF, That's correct. This assembly is plain old tin-lead, but our buyer purchases the bare PCB with lead-free HASL plating. My main concern was the regular tin-lead not coalescing with the PCB plating and having a weak intermetallic. I'm not fr

BGA Pull test

Electronics Forum | Tue Oct 26 08:41:56 EDT 2004 | Bob R.

When we first got into BGAs on ENIG we were getting joint cracking at in-circuit test. The joints were breaking in the Sn-Ni intermetallic. We did a lot of pull testing while working with our board suppliers and our conclusion was that pull testing

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Tue May 26 21:27:33 EDT 1998 | Earl Moon

| | | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered a

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Wed May 27 11:19:34 EDT 1998 | Earl Moon

| | | | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered

Re: Time to use alternative finishing ???

Electronics Forum | Mon Sep 13 05:02:19 EDT 1999 | Brian

| We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with

Re: Time to use alternative finishing ???

Electronics Forum | Mon Sep 13 06:23:06 EDT 1999 | Earl Moon

| | We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems wi

Re: HASL - again?

Electronics Forum | Fri Jun 18 14:19:29 EDT 1999 | Earl Moon

| | | Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rave re

Re: HASL - again?

Electronics Forum | Fri Jun 18 17:18:27 EDT 1999 | Jason Gregory

| | | | Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rave


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