Full Site - : fine-pitch (Page 9 of 262)

Call For Papers Issued For IPC Annual Meeting Technical Conference

Industry News | 2001-02-27 22:31:53.0

IPC has announced a call for papers for the IPC Annual Meeting, which takes place October 8-13, 2001, at the Rosen Centre Hotel in Orlando, FL.

Association Connecting Electronics Industries (IPC)

IPC’s Revised BGA Guideline Features Expanded Focus on Mechanical Reliability

Industry News | 2013-01-30 17:54:43.0

Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.

Association Connecting Electronics Industries (IPC)

IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium Announce Day 2 Keynote Speaker

Industry News | 2008-08-14 13:20:36.0

ROSEMONT, IL � Industry-leading associations IPC and SMTA announce that Linda Woody will keynote Day 2 of the jointly sponsored High-Performance Electronics Cleaning Symposium to be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.

Surface Mount Technology Association (SMTA)

Reading the Fine-Pitch — IPC-7525 Updated to Deal with New Materials

Industry News | 2012-06-09 14:33:06.0

To help designers and board assemblers address the challenges of working with new materials and smaller, finer-pitch components, IPC – Association Connecting Electronics Industries® released the B revision of IPC-7525, Stencil Design Guidelines.

Association Connecting Electronics Industries (IPC)

SMTA INTERNATIONAL 2009 BEST PAPERS ANNOUNCED

Industry News | 2009-12-17 18:14:47.0

MINNEAPOLIS, MN - The SMTA is pleased to announce the Best Papers from SMTA International 2009. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper.

Surface Mount Technology Association (SMTA)

International Conference on Soldering and Reliability (ICSR) Best of Conference Announced

Industry News | 2013-06-26 09:09:19.0

The SMTA announced Harald Grumm from Christian Koenen GmbH as the recipient of the Best of Conference Award for his presentation “The Potential of Stencil Technology – Choosing the Right Stencil Options to Maximize Yield and Earnings” at the 9th Annual International Conference on Soldering and Reliability, held May 14-17, 2013 at the Sheraton Toronto Airport, Ontario, Canada.

Surface Mount Technology Association (SMTA)

SMT, Inc. and Eruston Corp. Partner to Offer Complete Turnkey Manufacturing

Industry News | 2014-01-03 18:29:15.0

Surface Mount Technologies, Inc. announces that it has teamed with Eruston Corporation to offer complete turnkey manufacturing.

Surface Mount Technology Association (SMTA)

SMTA Announces Best of Conference From 2014 Pan Pacific Symposium

Industry News | 2014-03-11 17:31:51.0

The 19th Annual Pan Pacific Microelectronics Symposium that took place February 11-13, 2014, at the Hapuna Beach Prince Resort on the Big Island of Hawaii was well received by attendees from North America, Asia, and Europe.

Surface Mount Technology Association (SMTA)

Solder Paste and Solder Joint Automatic Inspection Experience at SMTA International

Industry News | 2015-07-06 10:34:12.0

The SMTA announces a new feature area that will debut during the SMTA International Electronics Exhibition: the “SMTA - NPL Solder Paste and Solder Joint Automatic Inspection Experience.” This special feature will take place during both days of the SMTA International Exhibition at the Donald Stephens Convention Center in Rosemont, Illinois on September 29 - 30, 2015.

Surface Mount Technology Association (SMTA)


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