We our an Online Store which sells Cable Ties,Solderless Terminals,Primary Wire,Fuses,Fuseholders,Split Loom,Spiral Wrap,Wire Nuts,Heat Shrink Tubing,Scotchloks,Copper Lugs, Electrical Tape, Speaker Wire and More
OEM in Electrical & Electronics Products (AC-DC Power Supplies, AC-AC Adaptors & AC-DC Adaptors). Dealing in Scrap Copper, Aluminium, Wire, Steel, Solder, Iron, Plastic, Electronic Components etc). Dealing in Used Equipments.
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We are a supplier of solder and soldering equipment and other products for the electronics industry.
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MICRONOX MX2100 is an aqueous, single-phase solvent designed to remove tough flux residue from PMIC devices including IGBT modules and power MOSFETs. MX2100 has a well-balanced formula that provides outstanding cleaning performance and metal compatib
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Bently Nevada* Asset Condition Monitoring Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile: (+86)-18020776786 QQ :2851195456 Bently Nevada 3500/15 AC/DC POWER SUPPLY The 3500/15 Power Supply is a half-hei
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A new silver-free and lead-free solder alloy is now available from Nihon Superior. It reduces the wear rate of soldering tips. It is a new alloy developed to reduce soldering tip wear. It can achieve an improvement of about threefold compared to SAC3
New Equipment | Industrial Automation
Bently Nevada* Asset Condition Monitoring Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile: (+86)-18020776786 QQ :2851195456 Bently Nevada 3500/15 AC/DC POWER SUPPLY The 3500/15 Power Supply is a half-hei
New Equipment | Industrial Automation
Bently Nevada* Asset Condition Monitoring Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile: (+86)-18020776786 QQ :2851195456 Bently Nevada 3500/15 AC/DC POWER SUPPLY The 3500/15 Power Supply is a half-hei
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http://www.yrtech.com.tw/eng/ Total Solution for Printed Circuit Board (PCB). Single sided, Double sided, Multilayered, HDI, FPC, Metal Core, Aluminum, Copper, Prototype, Design, Layout, Assembly
Technical Library | 2014-07-24 16:26:34.0
Wire bonding a die to a package has traditionally been performed using either aluminum or gold wire. Gold wire provides the ability to use a ball and stitch process. This technique provides more control over loop height and bond placement. The drawback has been the increasing cost of the gold wire. Lower cost Al wire has been used for wedge-wedge bonds but these are not as versatile for complex package assembly. The use of copper wire for ball-stitch bonding has been proposed and recently implemented in high volume to solve the cost issues with gold. As one would expect, bonding with copper is not as forgiving as with gold mainly due to oxide growth and hardness differences. This paper will examine the common failure mechanisms that one might experience when implementing this new technology.
