Industry Directory | Manufacturer
Shenzhen Honreal Technology Co., focus on global Surface Mount electronic assembly field for 15 years. Specializing in providing various brands of SMT pick and place machines and spare parts. Fuji, Panasonic, Juki, Hitachi, Yahama
Events Calendar | Wed Jun 22 00:00:00 EDT 2022 - Wed Jun 22 00:00:00 EDT 2022 | ,
Empire Chapter Webinar: LIVE Action Reflow Focused Process
Used SMT Equipment | Soldering - Reflow
Make: Vitronics Soltec Model: Centurion CT820 Vintage: 2019 Description: Reflow Oven Details: Edge Rail & Mesh Belt Conveyors Air 8 Heating Zones 2 Cooling Zones KIC Profiler Total Heating Length: 111.8 Max Gas Temperature Set Point: 350°C Auto Ch
Used SMT Equipment | Soldering - Reflow
Production Overview: The 1700 reflow soldering oven models support high mix / medium volume throughput… at speeds up to 24 inches (60 centimeters) per minute, while conserving valuable factory floor space. Rapid response times and precis
Industry Directory | Association / Non-Profit / Events Organizer / Training Provider
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
Used SMT Equipment | Soldering - Reflow
Heating zones: 5 Cooling zones: 2 Total heating length: 66 in. Total cooling length: 26 in. Total process length: 127 in. Total on /off load length: 11 in. Overall system length: 138.5 in. Overall system width: 52 in. Overall system height: 5
Technical Library | 2019-06-07 14:49:54.0
ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
A500, A600, A800 - 5, 6 or 8 top/bottom cooling zones. Heating System: Up to eight groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air co
Technical Library | 2019-06-11 09:36:13.0
An experiment was recently performed ACI Technologies for a customer that was interested in comparing the wetting of lead-free solders with varying temperature profiles and atmospheric conditions. In order to deliver an objective measurement of solder wetting (in addition to subjective inspection analysis), a simple wetting indicator pattern was added to the solder stencil in an area on the test vehicle that had exposed and unused copper.
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