Industry News | 2021-06-10 02:42:13.0
With the advent of 5G, especially the high integration, high density, miniaturization of packaging, and high process requirements in the electronics industry, detection efficiency is particularly important. Many manufacturers are not particularly clear about what role X-Ray can play and how to use X-Ray to improve the process and reduce the defect rate. Most manufacturers buy X-Ray because of the needs of customers. Those who are forced to buy X-Ray alone do not actually understand the important role that X-Ray can play in the production line.
Industry News | 2021-12-09 08:41:38.0
CES 2022: Joint Presentation of Optical In-vehicle Network Solution for Autonomous Vehicles
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New Equipment | Industrial Automation
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New Equipment | Industrial Automation
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Industry News | 2014-11-04 17:37:56.0
ADLINK Technology today announced the release of its latest industrial ATX motherboard, the IMB-M42H, featuring the 4th Gen Intel® Core™ i7/i5/i3/Pentium®/Celeron® Processor family and Intel® H81 chipset. The IMB-H42H supports integrated motion/vision application-based platforms with a leading price/performance ratio. Combined high-bandwidth PCIe x16, PCIe x4 and conventional PCI slots, superior and rugged I/O connectivity and optimal design make it an optimum solution for industrial automation applications.
Electronics Forum | Tue Nov 28 17:43:03 EST 2006 | IRAS
I'm looking to gain some knowledge on potential causes of solderballs on LGA's and advice on how to eliminate them. we all seeing some solderballs on only the edges of the LGA. Any inputs will be greatful.
Electronics Forum | Thu Sep 09 05:23:10 EDT 2010 | 15009
You can reduce and almost eliminate voids and other paste related defects in LGA's BGA's, QFN's etc, by using solid solder deposit. Its been around for 24 years, 13 in the US. It is now included in the new IPC 7093 specification for bottom terminat
Electronics Forum | Mon Apr 23 07:28:42 EDT 2012 | ccottreau
Has anybody any experience in cleaning the Jupiter 32 LGA in a Aqueous cleaning process (or any kind of shielded GPS Module). The manufacture does not recommend Aqueous cleaning because that length of drying time and that this may leave residue on th
Electronics Forum | Mon Aug 30 10:17:16 EDT 2010 | markgray
We currently use this devise in one of our designs with no issues. We are using a 3mil stencil and a 45% apperature reduction. It is virtually impossible to eliminate voids but they are in an acceptable range. Solder balls are caused on this componen
Electronics Forum | Wed Sep 01 06:18:05 EDT 2010 | grahamcooper22
Dear SMT Manufacturer, As moisture is eliminated as the cause then solder paste volume will probably be the main contributing factor. More paste means more chance of solder balls and more flux fumes that need to be evaporated to reduce voiding. Even
