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Different Techniques for Plating

Industry News | 2018-10-18 11:08:03.0

Different Techniques for Plating

Flason Electronic Co.,limited

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Re: Black hole process (MacDermitt) for PCB fab

Electronics Forum | Tue May 30 21:09:30 EDT 2000 | Dave F

Dennis: Direct metalization is more of an European phenomena than a US one. Not to say that good things don�t come out of Europe. As background: Direct Metallization. In circuit board fabrication, an alternative to electroless plating makes the

PCB Solder Finish Survey

Electronics Forum | Sat Jul 24 10:20:15 EDT 1999 | Bob Willis

PCB Solder Finishes Survey Questions 1999 Results for the 1996-7 survey are located at www.smartgroup.org As a number of SMART people have requested an update on the solder finishes survey SMART Group have run in the past here is your opportunity t

Re: Gold boards

Electronics Forum | Thu Jul 02 15:23:15 EDT 1998 | Justin Medernach

| | I'm having a problem getting good reflow on gold sufaced boards. The profile looks good and I have adjusted it both hotter and colder and adjusted the various times ( soak, reflow ) to no avail. What realy gets me Is that a month ago we built som

Re: Design Guides

Electronics Forum | Wed Jul 22 12:47:23 EDT 1998 | Earl Moon

| I'm trying to put together a set of design guides for use for new designers | in house or to be sent out for contracted layout work. I would like to start with a top ten list of things that will go wrong if rules aren't available. For example testp

OSP vs HASL

Electronics Forum | Mon May 14 17:12:20 EDT 2001 | davef

Continuing along the path that Brian took ... IPC-7525 gives design guideline for stepped stencils. It goes something like: * Stepped area SB GT 25 thou from pads located on the greatest thickness of the stencil * Pads in stepped area SB GT 35 tho

Re: BGA reflow profile

Electronics Forum | Tue Jul 28 17:23:58 EDT 1998 | Robert Steltman

| | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | | First some details: | | PCB & Device: | | ============= | | 1) 16 layer (4 power, 4 gnd, 8 signal) | | 2) gold on nickel finish | | 3) ceramic


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