Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Industry News | 2016-05-10 14:16:16.0
GPD Global offers individual pumps for integration into your existing platform – the Jetting NCM5000 Pump is one of them. The Jetting NCM5000 Pump simplifies jetting to its basic elements: hammer, pin, and nozzle. Only the pin and nozzle are wetted parts. This means easy set-up, cleaning, and upkeep.
Industry News | 2003-02-17 08:40:25.0
To Meet Government Environmental Standards and Individual Company Policies, While Satisfying Production Requirements
Industry News | 2003-03-28 08:46:12.0
The high scan speeds and fast setup times of the Excalibur system make it a good choice for this sector of the bare-board PCB manufacturing industry
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Industry News | 2003-06-23 08:49:39.0
Three Organizations from the US, Europe and Japan to
Industry News | 2003-06-19 08:13:11.0
The new heads are capable of reaching an acceleration of greater than 20g.
Industry News | 2003-04-07 10:16:38.0
Portable Products and Optoelectronic Applications Still Hold Promise for Growth
Model NO. : GW-UL250L , GW- UL330L ,GW- UL390L ,GW- UL460L PCB size(L×W)~(L×W) :(50×50)~(350×250),(50×50)~(455×330),(50×50)~(530×390),(50×50)~(530×460), Machine size (L×W×H) : 1370×750×1200 , 15