Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Industry News | 2016-03-09 16:11:24.0
Presenting "A Review of Jetting Technologies for Fluid Dispensing: Identifying the Features that Influence Productivity" on March 17, 2016, at 10:30 AM.
Industry News | 2015-07-08 14:20:26.0
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), a global leader in dispensing, jetting, and coating equipment and technologies, announces its new Programmable Tilt + Rotate 5-Axis Fluid Dispenser that enables the jet to dispense using 5 axes of automated control instead of only 3 axes. The additional X and Y tilt modes enable dispensing from a vertical position and at varying tilt angles along all four sides of a device and up the side of a substrate or component, especially for 3D packages, while meeting stringent requirements for precision, accuracy, and speed. It enables dispensing of underfill, encapsulant, and coating fluids around tall substrate components on PCBs, flexible circuits, and in densely populated boards; provides precision fluid delivery to multiple sides of the latest-generation mobile device cases and sub-component camera modules by moving the nozzle tip closer to a target location such as a vertical wall; and dispenses into tight corners and narrow gaps in advanced packages.
Industry News | 2014-02-13 23:58:33.0
Nordson ASYMTEK introduces the Quantum™ Q-6800 high-performance, large-format dispensing system for SMT, PCB packaging, and microelectronics assembly applications. Quantum’s dispense area of 423 x 458 mm handles a wide range of substrate sizes and is large enough so the dispense area isn’t compromised even with dual valve configurations, enabling flexibility in the dispensing process.
Industry News | 2016-11-10 20:24:06.0
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), the global leader in dispensing, jetting, and coating equipment and technologies, welcomes two distributors to provide sales, service, and support for Nordson ASYMTEK's fluid dispensing, jetting, and conformal coating equipment to customers in Switzerland. eXelsius® will manage the French-speaking areas of Switzerland (cantons: Genève, Jura, Neuchâtel et Vaud) while neutec electronic ag will manage the German and Italian-speaking areas and share responsibilities for Berne, Fribourg, and Valais.
Industry News | 2015-12-01 10:08:02.0
Nordson ASYMTEK has been honored with the 2015 Global Technology Award in the dispensing category for its Programmable Tilt + Rotate 5-Axis Fluid Dispenser. The award was presented at the Productronica expo, in Munich, Germany on November 10, 2015.
Industry News | 2016-05-17 18:32:00.0
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), was named the winner of SMT China's 2016 Vision Award in the dispensing category for its NexJet® NJ-8 with the ReadiSet™ jet cartridge. The Vision Awards recognizes companies for their remarkable achievements in China's electronics manufacturing industry. The Award was presented at NEPCON China, held April 26-28, 2016 in Shanghai, China.
Industry News | 2013-01-28 02:11:23.0
Offers precise, repeatable dispensing of phosphor for coating and encapsulation
Industry News | 2016-04-20 18:15:34.0
Nordson ASYMTEK will present a triple-valve, closed-loop system to jet conformal coating, a UV oven to cure it, and an automated coating inspection system to verify the coating results at the SMT Hybrid Packaging Show in Nuremberg, Germany, in the smartTec stand 7-109 from 26-28 April 2016. Nordson ASYMTEK's award-winning Quantum® Q-6800 high-performance, large-format dispensing system will jet underfill as part of the show's Future Packaging Line at stand 6-434.
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